QCC-744M-2-LGM52-TR-01-0-AA Bluetooth Audio SoC, LGM52 LGA-52 Tape & Reel

QCC-744M-2-LGM52-TR-01-0-AA Overview

The QCC-744M-2-LGM52-TR-01-0-AA is a compact audio system component in a low-profile LGA package designed for high-volume surface-mount assembly. The part number encodes package and supply format information, including a 52-pin LGA footprint and tape-and-reel delivery suited for automated pick-and-place. The suffixes indicate a specific revision and tape-and-reel packaging optimized for production. For sourcing and official product support, visit IC Manufacturer.

QCC-744M-2-LGM52-TR-01-0-AA Technical Specifications

QCC-744M-2-LGM52-TR-01-0-AA Key Features

• Compact LGA 52?pin package that reduces PCB area while keeping routing density manageable for tight board layouts.
• Tape-and-reel packaging to support high-throughput SMT assembly and consistent pick-and-place compatibility.
• Revision-coded 01-0-AA part marking for traceable production builds and BOM control during manufacturing.
• Surface-mount format that enables automated production flows and repeatable solder paste application for consistent yields.

Typical Applications

• Wireless earbud and true-wireless-stereo (TWS) modules where a small LGA footprint and reel supply streamline high-volume assembly and BOM management.
• Bluetooth-enabled headsets and on-head audio devices that require a compact, board-mounted audio system component compatible with automated placement.
• Portable speakers and docking audio products that need a high-density package to save board space while preserving routing options for power and RF paths.
• Embedded audio modules for consumer electronics design houses that require tape-and-reel delivery for efficient production and inventory control.

QCC-744M-2-LGM52-TR-01-0-AA Advantages vs Typical Alternatives

The part??s LGA 52?pin package and tape-and-reel supply make it better suited for high-volume automated manufacturing than larger through-hole or non-reel packaged equivalents. Its clear revision coding (01-0-AA) simplifies revision control versus generic multi-revision parts. Compared with larger-pin-count SMD devices, this LGA format reduces board area and can lower assembly cost per unit while still enabling dense I/O routing for audio and control signals.

QCC-744M-2-LGM52-TR-01-0-AA Brand Info

The QCC- prefix is associated with Qualcomm Technologies?? family of Bluetooth and audio SoCs. The QCC-744M-2-LGM52-TR-01-0-AA variant follows that naming convention and represents a packaged device intended for system-level audio applications and high-volume manufacturing. The brand emphasizes integration for consumer and pro-audio markets and global support channels for design-in and sourcing.

FAQ

What does LGM52 indicate?

LGM52 designates a land grid array package with 52 lands. It indicates the physical footprint and pin count that determine PCB pad layout and solder stencil design for assembly.

Is this device supplied on reel?

Yes. The TR suffix indicates tape-and-reel packaging intended for automated pick-and-place equipment and standard SMT production lines.

How is the revision identified?

The suffix 01-0-AA encodes the manufacturing or firmware revision information. Use the full part number to match BOM entries and firmware revisions in production documentation.

What mounting process is recommended?

Surface-mount assembly practices apply. Use a solder paste stencil matched to the LGA pad footprint and follow standard reflow profiles compatible with the package thermal mass.

How should I manage part traceability?

Keep the full part number including suffixes in procurement and BOM records. Track reel lot numbers from the supplier and align production batches to the 01-0-AA revision for consistent device behavior.