QCC-744M-2-LGM52-MT-01-0-AA Bluetooth Audio SoC LGM52-MT package

QCC-744M-2-LGM52-MT-01-0-AA Overview

The QCC-744M-2-LGM52-MT-01-0-AA is a compact, audio-focused system IC intended for advanced wireless audio applications. It combines a high-performance digital core with multiple I/O and power domains to support integrated audio processing, connectivity and peripherals in space-constrained modules. The device sheet shows a clear emphasis on integration, thermal margin and industrial temperature operation. For ordering and authorized distribution details, see IC Manufacturer.

QCC-744M-2-LGM52-MT-01-0-AA Technical Specifications

QCC-744M-2-LGM52-MT-01-0-AA Key Features

• Integrated audio processing ?? delivers on-chip DSP resources to handle audio decoding and mixing with lower system BOM and fewer external components.
• Multi-voltage domains ?? separate core and I/O supplies reduce noise and allow flexible power sequencing for robust system design.
• Industrial temperature range ?? rated from -40 ??C to +85 ??C for reliable operation in harsher environments and extended-product-lifetime designs.
• Compact QFN package ?? small board footprint lowers PCB area and simplifies module-level integration for consumer and industrial form factors.

Typical Applications

• Wireless audio headsets and earbuds that require integrated DSP and Bluetooth connectivity for improved battery life and reduced board complexity across high-volume designs.
• Portable speaker modules where compact size and on-chip audio processing reduce external component count and simplify enclosure thermal management for continuous use.
• In-vehicle infotainment peripheral modules that need industrial temperature tolerance, stable power domains and deterministic audio performance under variable conditions.
• Professional audio accessories and conference systems that demand reliable wireless audio links alongside onboard processing to control latency and signal quality in multi-microphone arrays.

QCC-744M-2-LGM52-MT-01-0-AA Advantages vs Typical Alternatives

The device sheet highlights higher integration and narrower board footprint compared with multi-chip solutions. With combined DSP, memory and radio interfaces on one package, the part reduces external components and assembly complexity. Its multi-voltage arrangement and industrial temperature rating improve thermal and electrical robustness. For designs that prioritize reduced BOM cost, smaller modules and consistent audio performance, this solution offers clearer benefits versus separate processor, memory and radio alternatives.

QCC-744M-2-LGM52-MT-01-0-AA Brand Info

This part is listed under Qualcomm-branded ICs known for wireless audio SoCs and Bluetooth solutions. The brand emphasizes audio performance, integrated connectivity and supplier support for high-volume manufacturing. Engineers choose these components when compact audio platforms and proven wireless stacks are required.

FAQ

What package options exist?

The product sheet lists a QFN package with 52 pins as the documented option. The compact QFN reduces PCB area and is optimized for module integration while providing the necessary pinout for power, audio and control signals.

What is the supported operating temperature?

Datasheet values indicate an operating range from -40 ??C to +85 ??C. This range supports both consumer and industrial applications that must withstand extended ambient temperature and thermal cycling.

How many external components are required?

Specification highlights on-chip memory, DSP and radio interfaces to minimize external passive and active components. Typical designs still require power decoupling, antenna matching and audio analog front-end components.

Is the device RoHS compliant?

The product listing specifies RoHS compliance. That compliance streamlines regulatory acceptance for assemblies intended for global markets and reduces lead-related handling requirements during production.

Where can I get authorized documentation?

Refer to the supplier page and authorized distributor portals, including the linked IC Manufacturer resource, for official datasheets, application notes and orderable part information to ensure correct procurement and design-in support.