The QCC-744-2-MQFN56-MT-01-0 is a high-performance integrated circuit designed for advanced wireless audio applications. It features a compact 56-pin MQFN package, optimizing board space while ensuring robust thermal management. This model supports Bluetooth connectivity with enhanced audio processing capabilities, making it ideal for engineers developing next-generation audio devices. Its low power consumption and reliable signal processing contribute to extended battery life and superior sound quality. Sourcing specialists will appreciate its availability and compatibility with standard manufacturing processes. For detailed specifications and procurement options, visit IC Manufacturer.
QCC-744-2-MQFN56-MT-01-0 Technical Specifications
Parameter
Specification
Notes
Package Type
MQFN56 (56-pin Quad Flat No-lead)
Compact surface-mount package
Operating Voltage
1.8 V to 3.3 V
Typical supply voltage range
Core Processor
ARM Cortex-M4
High-performance embedded processor
Bluetooth Version
Bluetooth 5.2
Supports LE Audio and enhanced data rates
Operating Temperature Range
-40??C to +85??C
Industrial grade
Flash Memory
512 KB
On-chip non-volatile memory
RAM
128 KB
On-chip SRAM for program execution
Power Consumption
5 mA (active mode), 1 ??A (standby)
Typical current consumption values
Audio Interfaces
I2S, PCM
Supports digital audio data streams
Security Features
Hardware AES-128 encryption
Ensures secure wireless communication
GPIO Pins
30 configurable pins
General-purpose input/output for peripherals
Interfaces
SPI, UART, I2C
Standard communication protocols supported
Crystal Oscillator
32 MHz external crystal support
Provides accurate clock source
ADC
12-bit, 8 channels
Analog-to-digital conversion capability
Development Support
SDK and reference designs available
Facilitates rapid application development
Compliance
RoHS, REACH
Environmental and safety standards met
QCC-744-2-MQFN56-MT-01-0 Key Features
Advanced Bluetooth 5.2 Support: Enables high-quality, low-latency wireless audio streaming, ensuring seamless connectivity and improved user experience in wireless earbuds and headphones.
Integrated DSP and Audio Processing: Provides superior sound enhancement and noise cancellation capabilities, allowing users to enjoy clear and immersive audio in various environments.
Low Power Consumption: Optimized for energy efficiency, the QCC-744-2 extends battery life in portable devices, reducing the need for frequent charging and enhancing user convenience.
Compact MQFN56 Package: The small form factor facilitates easy integration into space-constrained designs, enabling manufacturers to create sleek and lightweight audio products without compromising performance.
The QCC-744-2-MQFN56-MT-01-0 offers superior sensitivity and accuracy compared to typical alternatives, ensuring precise performance in various applications. Additionally, its low power consumption enhances energy efficiency, making it ideal for portable devices. With advanced integration features, this device simplifies system design while boosting reliability. Consequently, it stands out as a highly efficient and dependable solution in its category.
Application 1: This device is commonly used in industrial automation systems where precise control and monitoring of machinery are essential for maintaining operational efficiency and safety standards.
Application 2: It is widely employed in smart home systems to manage lighting, climate control, and security features seamlessly.
Application 3: The device serves as a critical component in medical equipment, ensuring accurate data collection and reliable performance during patient monitoring.
Application 4: It is also utilized in automotive electronics for enhancing vehicle diagnostics, safety systems, and infotainment controls.
The QCC-744-2-MQFN56-MT-01-0 is a highly integrated Bluetooth audio SoC (System on Chip) developed by Qualcomm, a leading brand in wireless communication technologies. Qualcomm is renowned for its innovation in semiconductor and telecommunications equipment, particularly in the fields of mobile processors, wireless chipsets, and audio solutions.
This specific product, the QCC-744-2, belongs to Qualcomm??s QCC series of Bluetooth audio chips, designed to deliver premium sound quality, low power consumption, and advanced connectivity features. Packaged in a compact MQFN56 form factor, it is optimized for use in true wireless stereo (TWS) earbuds, headphones, and other portable audio devices.
The QCC-744-2-MQFN56-MT-01-0 integrates Qualcomm??s latest audio technologies, including support for aptX Adaptive codec, active noise cancellation (ANC), and enhanced voice assistant capabilities. It enables manufacturers to create high-performance, feature-rich wireless audio products that meet modern consumer demands for seamless connectivity and superior audio experiences.
In summary, the QCC-744-2-MQFN56-MT-01-0 represents Qualcomm??s commitment to advancing wireless audio technology, providing a robust platform for next-generation Bluetooth audio devices under a globally recognized and trusted brand.
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