QCC-743M-1-LGM36A-MT-01-0-AB Bluetooth Audio SoC LGM36A-MT package

QCC-743M-1-LGM36A-MT-01-0-AB Overview

The QCC-743M-1-LGM36A-MT-01-0-AB is a connectivity component described in the supplied product sheet. It targets compact audio and wireless applications where integration and board-level assembly matter. The part is presented with a specific surface-mount package and interface set suitable for module-level integration. Designers will find concise mechanical and ordering details on the sheet. For procurement and additional documentation, refer to the manufacturer’s resources at IC Manufacturer. The sheet emphasizes board mounting, part marking, and packaging format for supply-chain planning.

QCC-743M-1-LGM36A-MT-01-0-AB Technical Specifications

QCC-743M-1-LGM36A-MT-01-0-AB Key Features

• High-integration connectivity block for compact designs, reducing board area and simplifying BOM.
• Surface-mount package and tape-and-reel supply that eases automated assembly and lowers placement cost.
• Documented pinout and recommended land pattern that improve yield and speed up layout verification.
• Traceable part marking for reliable identification across production and inspection workflows.

QCC-743M-1-LGM36A-MT-01-0-AB Advantages vs Typical Alternatives

This part emphasizes board-level integration and assembly-readiness compared with more fragmentary components. The included land pattern guidance and tape-and-reel packaging streamline manufacturing. The clear marking and compliance notes reduce sourcing friction. These attributes result in faster design cycles and fewer PCB redesigns when compared to less-documented alternatives.

Typical Applications

• Compact wireless audio headsets and earbud module assemblies where small package size and clear PCB footprint guidance speed time to market.
• Consumer audio modules requiring a packaged connectivity device that supports automated SMT assembly and tape-and-reel procurement.
• Reference designs and evaluation modules where accurate part marking and documented pinout reduce integration errors and debug time.
• High-volume production lines where traceability, reel packaging, and surface-mount readiness help control manufacturing cost and throughput.

QCC-743M-1-LGM36A-MT-01-0-AB Brand Info

This product corresponds to a leading wireless SoC manufacturer known for audio and connectivity silicon. The brand voice emphasizes engineering-grade documentation, production-focused packaging, and comprehensive board-level integration guidance to support rapid development and high-volume manufacturing.

FAQ

What package is used?

The sheet shows a surface-mount package with a defined body outline and leadframe. Land pattern guidance and placement notes are included to aid PCB layout and assembly.

How is the part packaged?

Packaging information on the sheet indicates a tape-and-reel format suitable for automated pick-and-place lines. Reel dimensions and orientation details help with inventory and placement planning.

Does the sheet include pinout details?

Yes. The supplied drawing contains a pinout map and recommended PCB land pattern. Those details support signal routing and mechanical placement during design.

Is part marking provided?

The document includes top-side marking and traceability codes for production verification. Marking notes assist incoming inspection and traceability workflows on the factory floor.

Where to find compliance notes?

Compliance and handling notes are presented on the sheet. They include standard finish and environmental compliance statements to support procurement and regulatory review.