QCC-730-1-WLPSP90-TR-03-0-02 Overview
The QCC-730-1-WLPSP90-TR-03-0-02 is a discrete integrated-circuit part identified by a clear manufacturer code, package type and tape-and-reel packing format. The string indicates a WLP style package with an SP90 pad count and a tape-and-reel shipment mode marked by TR. The trailing code 03-0-02 denotes a specific manufacturing or revision identifier for traceability. For ordering and sourcing details consult the official product page at IC Manufacturer. The format suits high-volume pick-and-place and close-tolerance board designs.
QCC-730-1-WLPSP90-TR-03-0-02 Technical Specifications
| Parameter | Value |
|---|---|
| Full Part Number | QCC-730-1-WLPSP90-TR-03-0-02 |
| Series / Family Code | 730 |
| Variant | 1 |
| Package Type | WLP (Wafer-Level Package) |
| Package Pad Count (code) | SP90 (90 pads) |
| Packaging Method | Tape & Reel (TR) |
| Revision / Lot Identifier | 03-0-02 |
| Mounting Style | Surface-mount |
| Intended Use | Board-level SMD placement (high-density) |
| Traceability | Explicit revision code 03-0-02 |
QCC-730-1-WLPSP90-TR-03-0-02 Key Features
- High-density WLP footprint: 90-pad WLP reduces board area versus larger discrete packages while keeping similar connectivity density.
- Tape-and-reel packing: TR format supports automated placement lines and fast reel-to-reel handling for volume assembly.
- Clear revision code: the 03-0-02 suffix provides direct lot and revision identification for production traceability and quality control.
- Surface-mount suitability: designed for standard SMD reflow processes, enabling consistent pick-and-place throughput and low profile integration.
Typical Applications
- Compact consumer-electronics modules where a low-profile 90-pad wafer-level package reduces PCB area and supports dense routing for multi-layer boards.
- Automated manufacturing lines that require tape-and-reel formats for high-volume pick-and-place and consistent component feed reliability over long runs.
- Small form-factor industrial controls that need traceable revision identifiers to maintain configuration control across firmware and hardware revisions.
- Prototyping and production environments where surface-mount WLP devices are preferred for thermal and electrical proximity in space-constrained designs.
QCC-730-1-WLPSP90-TR-03-0-02 Advantages vs Typical Alternatives
Compared with larger leaded or QFN alternatives, the WLP SP90 option offers a smaller board footprint and a lower package profile. The tape-and-reel shipment format reduces manual handling and increases placement speed on automated lines. The explicit 03-0-02 revision marker supports better traceability than parts that rely on separate lot labels. Together, these aspects improve integration density, assembly throughput, and production traceability relative to more generic package-and-packaging combinations.
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QCC-730-1-WLPSP90-TR-03-0-02 Brand Info
QCC-730-1-WLPSP90-TR-03-0-02 appears under the QCC family designation commonly associated with a major semiconductor vendor focused on connectivity and system-on-chip solutions. The brand voice emphasizes high-density packaging, automated assembly readiness and revision traceability for professional OEMs and contract manufacturers.
FAQ
What does WLPSP90 mean?
WLPSP90 indicates a wafer-level package with an SP90 pad pattern. It implies 90 external pads or contacts in a WLP format. This naming helps procurement and PCB designers match pad layouts and solder-mask openings during board design.
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Is TR tape-and-reel packaging?
Yes. The TR suffix denotes tape-and-reel shipment. That format is optimized for automated pick-and-place equipment and is standard for high-volume SMT assembly. Verify reel quantity and leader/trailer details on the supplier packing sheet.
How to use the revision code 03-0-02?
Treat 03-0-02 as the manufacturer??s internal revision or lot identifier. Record it in BOMs and build tickets to ensure hardware and firmware versions remain matched during builds, recalls, or quality investigations.
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Can I place this part by reflow?
Yes. The surface-mount wafer-level package is compatible with standard reflow processes used for SMD components. Follow the supplier??s recommended thermal profile if available, and use appropriate stencil design for BGA-like pad patterns when applicable.
Where to find full datasheet and reel specs?
Consult the official product listing or distributor page referenced by the full part number to obtain the datasheet, reel quantities, tape dimensions, and recommended PCB land pattern. The linked manufacturer portal provides the authoritative mechanical and assembly data.




