QCC-3096-0-WLNSP99-SR-06-0 Bluetooth Audio SoC (WLNSP99 package)

QCC-3096-0-WLNSP99-SR-06-0 Overview

The QCC-3096-0-WLNSP99-SR-06-0 is a compact audio system-on-chip designed for wireless earbud and headset designs that demand low power and advanced audio processing. It targets true wireless stereo and Bluetooth audio endpoints with integrated audio DSP, codec support and system peripherals. The part number indicates a WLCSP-style package with a 99-ball mapping, optimized for small PCB area and high-density assemblies. Engineers and sourcing teams will find this device positioned for balanced power, audio quality and board-level integration. See IC Manufacturer for procurement and distribution details.

QCC-3096-0-WLNSP99-SR-06-0 Technical Specifications

QCC-3096-0-WLNSP99-SR-06-0 Key Features

• Integrated audio DSP for real-time processing, delivering cleaner voice and music reproduction compared with generic microcontrollers.
• Compact WLCSP 99-ball package that reduces PCB footprint and supports higher-density module designs versus larger QFN packages.
• Built-in support for common Bluetooth audio codecs to simplify firmware integration and compatibility across many consumer devices.
• Designed for low-power operation, enabling longer playback and standby times compared with older-generation audio SoCs.

QCC-3096-0-WLNSP99-SR-06-0 Advantages vs Typical Alternatives

Compared with typical discrete solutions, this device combines audio DSP, codec handling and RF interface in one compact WLCSP package. The 99-ball footprint offers smaller board area and denser placement than equivalent QFN parts, while integrated audio processing reduces BOM count. Engineers get faster time-to-market and lower system-level power compared with multi-chip alternatives.

Typical Applications

• True wireless stereo earbuds where compact module size, integrated audio DSP and codec interoperability reduce PCB area and simplify board layout for sub-10 mm enclosures.
• Bluetooth headsets targeting multi-codec playback and improved voice call experience with on-chip audio processing for noise suppression and echo cancellation.
• Wearable audio accessories that prioritize low power and compact packaging to extend battery life and fit within small mechanical housings.
• OEM module designs that require a single-chip audio solution to lower component count, minimize external memory and speed up firmware integration.

QCC-3096-0-WLNSP99-SR-06-0 Brand Info

This part number belongs to the Qualcomm QCC family. The QCC series focuses on wireless audio SoCs for earbuds and headsets. The brand emphasizes integrated audio processing, low power and broad codec support for consumer audio OEMs and module makers.

FAQ

Is this part suitable for TWS earbuds?

Yes. The design intent of the QCC-3096 series is for true wireless stereo applications. Its miniaturized WLCSP footprint and integrated audio DSP make it suitable for compact earbud modules and reference designs.

What package does this device use?

This specific ordering code indicates a WLCSP-style package with a 99-ball mapping. That package optimizes PCB area and is typically used where board space and weight are constrained.

Does it include on-chip audio processing?

Yes. The device integrates a dedicated audio DSP block for functions such as noise suppression, echo cancellation and enhancement, offering improved audio quality without external DSP chips.

Can it reduce BOM count?

Yes. By combining wireless connectivity, codec handling and audio DSP on a single silicon die, the device reduces the need for separate codec chips and external audio processors, simplifying BOM and assembly.

Who should evaluate this device?

Evaluation is recommended for OEM hardware engineers, module integrators and sourcing teams developing compact Bluetooth headsets and earbuds that require integrated audio features and a small package footprint.