QCC-3096-0-WLNSP99-HR-06-0 Overview
The QCC-3096-0-WLNSP99-HR-06-0 is a compact wireless audio system-on-chip tailored for high-efficiency Bluetooth audio designs. It targets consumer and industrial headsets, true wireless stereo (TWS) earbuds, and compact speaker systems that need smaller footprints and lower power. The device balances audio processing, wireless connectivity, and integration to reduce bill-of-materials and board area. Engineers and sourcing specialists can compare it directly with adjacent QCC series parts for optimization. More product and sourcing resources are available at IC Manufacturer.
QCC-3096-0-WLNSP99-HR-06-0 Technical Specifications
| Parameter | Value |
| Device type | Bluetooth audio System-on-Chip (SoC) |
| Bluetooth version | Bluetooth 5.x compatible |
| CPU cores | Dual-core DSP/MCU architecture |
| Audio DSP | Integrated audio DSP for codecs and ANC |
| Memory (on-chip) | Embedded program and data memory (on-chip) |
| Package | Low-profile land grid / QFN-style package |
| Operating temperature | Industrial range suitable for -40??C to +85??C systems |
| Supply voltage | Multi-rail support for core and I/O domains |
| Interfaces | I2S, PCM, PDM, GPIO, UART, SPI, I2C |
| Power management | Low-power modes for extended battery life |
QCC-3096-0-WLNSP99-HR-06-0 Key Features
- Integrated Bluetooth audio connectivity ?? reduces external RF components and simplifies RF certification for faster time-to-market.
- On-chip audio DSP ?? supports advanced codecs and ANC processing for clearer voice and better noise suppression.
- Compact package ?? enables smaller PCBs and tighter mechanical integration than many module-based solutions.
- Multiple low-power states ?? extends battery runtime in portable products and reduces thermal load compared with higher-power alternatives.
QCC-3096-0-WLNSP99-HR-06-0 Advantages vs Typical Alternatives
The device offers higher integration and smaller footprint than discrete RF-plus-DSP solutions. It provides comparable audio processing capability while requiring fewer external components. For engineers who prioritize board space and power efficiency, it represents a more compact and streamlined option than modular or multi-chip approaches.
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Typical Applications
- True wireless stereo (TWS) earbuds requiring integrated Bluetooth audio, on-chip DSP for ANC and voice, and minimal PCB area for compact enclosures.
- Wireless headset systems that need robust voice capture and noise suppression while minimizing power draw for longer talk time and standby.
- Portable Bluetooth speakers that benefit from integrated audio processing and simplified RF layout for faster product development cycles.
- Industrial wearable audio devices that demand reliable wireless audio links, low-power operation, and small form factor for harsh environment use.
QCC-3096-0-WLNSP99-HR-06-0 Brand Info
QCC-3096-0-WLNSP99-HR-06-0 is part of the Qualcomm Technologies audio SoC family. The brand emphasizes integration, audio performance, and low-power wireless connectivity for consumer and industrial audio products.
FAQ
What wireless standards does it support?
The product supports Bluetooth audio profiles and Bluetooth 5.x class connectivity suitable for A2DP, HFP, and LE-based links. It is designed to meet standard wireless audio interoperability expectations for modern devices.
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How does it support active noise cancellation?
The on-chip audio DSP enables ANC algorithms and voice processing. Designers can implement feedforward and feedback ANC topologies using the integrated DSP and PDM/I2S interfaces for microphone and speaker data.
What interfaces are available for peripherals?
The SoC exposes standard digital interfaces such as I2S, PCM, PDM, UART, SPI, I2C, and GPIO. These interfaces allow integration with codecs, sensors, charging controllers, and application microcontrollers.
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Can it reduce BOM and board area?
Yes. The integrated RF, baseband, and audio processing reduce the need for multiple external chips. This lowers component count and enables smaller PCB designs compared with discrete solutions.
Is it suited for battery-powered devices?
Yes. The part includes low-power modes and efficient power domains to extend battery life. It is optimized for portable audio applications where run-time and standby current are critical design factors.
