QCC-3095-0-CSP134A-TR-06-0 Bluetooth Audio SoC CSP134A Package

QCC-3095-0-CSP134A-TR-06-0 Overview

The QCC-3095-0-CSP134A-TR-06-0 is a compact Bluetooth audio system-on-chip (SoC) part of Qualcomm’s QCC family, aimed at low-power wireless audio designs for true wireless earbuds, neckbands, and compact speakers. It ships in a chip-scale package optimized for automated surface-mount assembly and taped reel delivery for high-volume production. Engineers choose this device for integration into size- and power-constrained products where voice pickup, battery life, and reliable Bluetooth connectivity matter. For sourcing and component data, see IC Manufacturer

QCC-3095-0-CSP134A-TR-06-0 Technical Specifications

QCC-3095-0-CSP134A-TR-06-0 Key Features

• Integrated audio processing ?? on-chip DSPs handle voice capture and audio rendering for lower system BOM and faster time-to-market.
• Low-power operation ?? designed to extend battery life versus general-purpose Bluetooth modules, improving playtime in small form-factor products.
• Compact footprint ?? CSP packaging reduces board area and helps manufacturers fit advanced connectivity into smaller enclosures.
• Manufacturing-friendly ?? tape-and-reel supply and SMD mounting streamline high-volume assembly and reduce per-unit manufacturing cost.

QCC-3095-0-CSP134A-TR-06-0 Advantages vs Typical Alternatives

This SoC offers a more integrated audio platform and a smaller physical footprint compared to many discrete MCU-plus-radio approaches. It reduces component count, simplifies PCB layout, and typically delivers better battery efficiency and faster certification cycles than mixed-vendor solutions.

Typical Applications

• True wireless stereo (TWS) earbuds where minimal board area and optimized power consumption extend playtime while supporting dual-ear synchronization and low-latency audio.
• Neckband and in-ear monitors that require long battery life, compact RF subsystems, and robust voice mic processing in constrained mechanical designs.
• Compact Bluetooth speakers that need efficient audio DSP, seamless smartphone pairing, and straightforward BOM consolidation for cost-sensitive consumer products.
• Voice-enabled wearable devices where on-chip audio processing and small package size help integrate far-field or near-field voice capture with reduced external components.

QCC-3095-0-CSP134A-TR-06-0 Brand Info

Qualcomm Technologies, Inc. designs the QCC family as a leader in wireless audio silicon. The brand emphasizes integrated audio processing, low-power Bluetooth platforms, and an ecosystem of SDKs and reference designs for consumer and industrial audio products.

FAQ

What is the package type?

The device is supplied in a chip-scale package (CSP), indicated by the CSP134A suffix and intended for surface-mount assembly on automated production lines.

Is tape-and-reel packaging available?

Yes, the -TR notation denotes tape-and-reel packaging suitable for automated pick-and-place and reflow processes; check vendor packaging quantity and reel size when ordering.

Where can I get software support?

Software support typically comes from Qualcomm’s SDK, reference designs, and partner tools. Contact your distributor or Qualcomm’s developer resources for firmware, libraries, and integration guides.

Is this part RoHS compliant?

The product listing and manufacturer documentation identify it as RoHS-compliant and lead-free, consistent with mainstream consumer electronics manufacturing requirements.

Can it be used for TWS earbud designs?

Yes??this SoC is intended for compact wireless audio endpoints such as TWS earbuds and similar devices where integrated audio processing and low power are priorities; consult reference designs for best practices.

LSI keywords: Bluetooth audio SoC, wireless audio chip, TWS platform, low-power audio silicon, CSP package, tape and reel, Qualcomm QCC series, audio DSP, ANC support, codec support, SBC, AAC, aptX, firmware SDK, reference design, embedded Bluetooth, voice pickup, microphone array, SMD, RoHS