QCC-3091-0-WLNSP99-HR-06-0 Bluetooth Audio SoC (WLNSP99 Package)

QCC-3091-0-WLNSP99-HR-06-0 Overview

IC Manufacturer lists the QCC-3091-0-WLNSP99-HR-06-0 as a compact wireless audio system component. The part is presented as a complete solution aimed at low-power, high-efficiency audio products. It targets wearable and personal-audio designs that require integrated RF, audio processing, and power management in a small package. The description emphasizes integration, low standby current, and support for modern Bluetooth audio profiles, making the device suitable for tight board-space and battery-constrained designs.

QCC-3091-0-WLNSP99-HR-06-0 Technical Specifications

QCC-3091-0-WLNSP99-HR-06-0 Key Features

• Integrated RF and audio DSP ?? reduces BOM count and shortens development time by combining wireless connectivity and audio processing on one module.
• Low-power standby ?? extends battery life in typical wearable use by minimizing quiescent current in idle modes.
• Multiple digital interfaces ?? supports I2S, PCM, SPI and UART for flexible integration with sensors, codecs, and host microcontrollers.
• Compact module footprint ?? enables smaller PCB area versus discrete RF plus DSP solutions, aiding miniaturized earbud and hearable designs.

QCC-3091-0-WLNSP99-HR-06-0 Advantages vs Typical Alternatives

The module offers a higher level of integration versus separate RF transceivers and audio processors. It typically reduces external components by up to 60% and saves PCB area by a comparable margin. For battery-powered designs, the lower standby current gives longer idle life compared with legacy solutions. Integration of standard interfaces simplifies firmware porting and shortens time to market.

Typical Applications

• True wireless stereo earbuds and in-ear monitors that need integrated Bluetooth connectivity, onboard DSP for codecs and voice, and a minimal board footprint for compact housings.
• Neckband and headset designs that require low standby current, robust audio performance, and multiple digital interfaces for microphones and control inputs.
• Wearable audio devices with strict power budgets that benefit from an integrated RF + DSP module to reduce external power management and increase battery run time.
• Consumer audio peripherals such as dongles and compact speakers that require reliable wireless audio streaming and simplified host integration through standard interfaces.

QCC-3091-0-WLNSP99-HR-06-0 Brand Info

The QCC-3091-0-WLNSP99-HR-06-0 designation corresponds to a wireless audio module from a major IC vendor focused on consumer audio silicon. The brand emphasizes system-level integration, low-power operation, and broad software ecosystem support for audio codecs and wireless profiles.

FAQ

What is the primary use case?

The primary use case is compact, battery-powered audio devices where integrated RF, DSP, and power efficiency are critical. The module is suited to earbuds, headsets, and small speakers that require streamlined BOM and small PCB area.

Which interfaces does it support?

Standard digital interfaces include I2S and PCM for audio, plus SPI and UART for control and diagnostics. These interfaces enable straightforward integration with external codecs, sensors, and host microcontrollers.

How does it affect battery life?

Low standby current and efficient audio processing reduce overall power draw in idle and active states. Designers can expect extended battery run time compared with solutions using separate RF and DSP components.

Is it suitable for ANC or voice processing?

Yes. The integrated DSP subsystem supports audio algorithms such as active noise cancellation and voice enhancement. This consolidation simplifies firmware and reduces the need for external processing cores.

What environmental range does it support?

The specified operating range covers typical industrial and consumer conditions from -40 ??C to +85 ??C. This supports use in a wide range of climates and portable device scenarios.