QCC-3046-0-WLNSP94BTR-01-0 Bluetooth Audio SoC, WLNSP94BTR package

QCC-3046-0-WLNSP94BTR-01-0 Overview

The QCC-3046-0-WLNSP94BTR-01-0 is a high-integration wireless audio system-on-chip designed for compact consumer audio products. It targets low-power, small-footprint designs and integrates the key blocks needed for Bluetooth audio endpoints. The device reduces board count and shortens time-to-market for true wireless and stereo headsets. Use it when a single-chip solution that balances connectivity, audio processing, and power management is preferred. For sourcing and reference designs visit IC Manufacturer.

QCC-3046-0-WLNSP94BTR-01-0 Technical Specifications

QCC-3046-0-WLNSP94BTR-01-0 Key Features

• One-chip Bluetooth audio endpoint that reduces component count and saves board area compared with multi-chip solutions.
• Integrated audio processing blocks that enable common codec processing and voice paths, which improves latency and playback quality in practical devices.
• Power management integration that delivers lower system power and longer playback time versus designs that use separate power controllers.
• Compact package and surface-mount compatibility that simplify automated assembly and deliver smaller product enclosures compared with larger packaged alternatives.

QCC-3046-0-WLNSP94BTR-01-0 Advantages vs Typical Alternatives

The device offers a higher level of integration and a smaller footprint when compared to discrete solutions. It combines RF, audio processing, and power control in one package. This results in fewer external components, simpler BOMs, and faster assembly. For engineers, that translates to quicker iterations and competitive time-to-market without sacrificing audio endpoint capability.

Typical Applications

• True wireless stereo earbuds where minimal board area and integrated power control allow longer playback in smaller enclosures and fewer external components.
• Compact over-ear or on-ear wireless headsets that require stable Bluetooth audio links and on-chip audio processing to reduce external DSP requirements.
• Neckband and sport audio accessories that benefit from integrated power management and a single-chip solution to extend run time and reduce weight.
• Portable hands-free and voice-enabled accessories that need reliable wireless audio connectivity and an integrated audio path for microphones and speakers.

QCC-3046-0-WLNSP94BTR-01-0 Brand Info

Qualcomm Technologies supplies the QCC family of audio chipsets used across consumer wireless audio products. The QCC-3046 series is positioned for small-form-factor Bluetooth audio endpoints and benefits from the vendor’s ecosystem of SDKs, reference designs, and certification support.

FAQ

What type of device is this?

This part is a wireless audio system-on-chip intended for Bluetooth audio endpoints. It integrates RF and audio functions to support compact headphone and earbud designs.

Is it suitable for true wireless earbuds?

Yes. It is targeted at true wireless and compact stereo headsets where a single, integrated chip reduces board area and simplifies the bill of materials for small enclosures.

What packaging and mounting are used?

The part is supplied in a compact wafer-level or small-package form suitable for surface-mount assembly. This supports automated pick-and-place processes in high-volume production.

Where to find software and design resources?

Manufacturer-provided documentation, SDKs and reference designs are available from Qualcomm and authorized distributors. Use those resources for hardware bring-up and firmware integration.

How does it compare on BOM and assembly?

Compared with multi-chip approaches, this integrated device reduces the number of external components and PCB area. That lowers assembly complexity and can shorten manufacturing cycles.