QCA-8695AU-0-DRQFN130-TR-03-0 Wireless Combo SoC (Wi-Fi/Bluetooth) – DRQFN130

  • Integrated radio subsystem delivers reliable wireless connectivity, simplifying product integration.
  • High throughput supports smooth data transfer, reducing latency for real-time.
  • Small-package design saves board space and improves battery life significantly.
  • Ideal for consumer routers, boosting throughput while simplifying antenna integration.
  • QCA-8695AU-0-DRQFN130-TR-03-0 undergoes rigorous testing to ensure long-term reliability and QA
Qualcomm-logo
产品上方询盘

QCA-8695AU-0-DRQFN130-TR-03-0 Overview

The QCA-8695AU-0-DRQFN130-TR-03-0 is a compact, high-pin-count integrated circuit offered in a 130-pin DRQFN package. The part designation indicates a production-ready tape-and-reel format for automated assembly and a dense lead-count for complex board-level integration. This listing is intended for engineers and sourcing specialists who need clear packaging, mounting, and part-identification details before accessing datasheets and design resources from IC Manufacturer.

QCA-8695AU-0-DRQFN130-TR-03-0 Technical Specifications

Parameter Value
Part Number QCA-8695AU-0-DRQFN130-TR-03-0
Series Code 8695
Package Type DRQFN130
Pin Count 130
Mounting Surface-mount device (SMD)
Packaging Format Tape & Reel (TR-03-0)
Product Family Prefix QCA
Full Designator QCA-8695AU-0-DRQFN130-TR-03-0
Typical Board Assembly Automated pick-and-place compatible
Intended Use Integrated circuit module (board-level implementation)

QCA-8695AU-0-DRQFN130-TR-03-0 Key Features

  • High pin density ?? 130 pins provide more I/O and power/ground distribution compared with lower-pin QFN parts, enabling finer segregation of signals and power domains.
  • DRQFN package ?? low-profile footprint supports smaller enclosures and better thermal path to PCB than some plastic packages, which matters for compact, high-density designs.
  • Tape-and-reel delivery ?? the TR-03-0 packaging supports reel-fed automated assembly and higher throughput compared with loose or tray-packed components.
  • Standardized part marking ?? the full part code provides traceability for procurement and lifecycle management when compared with generic or unlabeled equivalents.

Typical Applications

  • Dense, board-level systems that require a 130-pin surface-mount IC for complex I/O mapping and segregated power rails in industrial control equipment.
  • High-volume automated manufacturing environments where tape-and-reel packaging reduces machine downtime and improves placement accuracy versus tray-based options.
  • Compact embedded modules where a low-profile DRQFN130 package enables smaller mechanical envelopes and improved thermal coupling to the PCB.
  • Prototyping and production runs that need clear part traceability and consistent reel-based supply for repeatable assembly and reduced handling variability.

QCA-8695AU-0-DRQFN130-TR-03-0 Advantages vs Typical Alternatives

This part stands out when compared with lower-pin or through-hole alternatives by offering a much higher lead count in a smaller volume. The DRQFN130 form factor gives better board-level thermal routing and a lower profile than many larger BGA options. Tape-and-reel packaging improves pick-and-place throughput versus tray packaging, reducing per-unit handling time and production variability. For sourcing and production, the standardized full part code simplifies cross-referencing and inventory control relative to unlabeled or partial-code components.

QCA-8695AU-0-DRQFN130-TR-03-0 Brand Info

QCA-coded parts originate from the Qualcomm Atheros portfolio, a well-known supplier of connectivity and system ICs. The QCA designation identifies the vendor family and supports sourcing from authorized channels. Use manufacturer documentation and authorized distributor listings to confirm revision, firmware, and application support for specific board-level integration.

FAQ

How many pins does this package have?

The DRQFN package is identified as DRQFN130, which corresponds to 130 electrical pins. This pin count supports more signal routing points and separate power/ground pads compared with typical QFN devices with fewer pins.

What does TR-03-0 mean?

TR-03-0 appears in the part string to indicate tape-and-reel packaging for automated assembly. Tape-and-reel formats facilitate high-speed pick-and-place processes and are preferred for production compared with bulk or tray packaging.

Is this part surface-mount compatible?

Yes. The DRQFN130 form factor is a surface-mount device designed for reflow soldering and automated PCB assembly. Board layout should include appropriate solder paste and thermal pad design per the manufacturer’s recommended land pattern.

📩 Contact Us

产品中间询盘

Where can I find the datasheet?

Consult the manufacturer’s official website or authorized distributors for the full datasheet and mechanical drawings. The full part number in procurement and BOMs ensures you retrieve the correct revision and package information for design and compliance checks.

How should I handle procurement traceability?

Use the complete part code QCA-8695AU-0-DRQFN130-TR-03-0 on purchase orders and BOMs. That full designator preserves package, reel, and revision details and simplifies lifecycle management compared with shortened or ambiguous part numbers.

Application

, ,

Save cost and time

Fast global delivery

Original parts guaranteed

Expert after-sale support

Looking for a Better Price?