QCA-8695AU-0-DRQFN130-MT-03-0 Overview
The QCA-8695AU-0-DRQFN130-MT-03-0 is a high-density integrated circuit part identifier offered through distribution channels. The designation shows a QCA series device in a 130-pin DRQFN package and a specific manufacturing code. Use this listing for procurement, BOM referencing, and mechanical planning. For sourcing and official documentation, consult IC Manufacturer.
QCA-8695AU-0-DRQFN130-MT-03-0 Technical Specifications
| Part Number | QCA-8695AU-0-DRQFN130-MT-03-0 |
| Series Identifier | 8695 |
| Variant | AU-0 |
| Package Type | DRQFN130 |
| Pin Count | 130 |
| Packaging Method | MT (tape & reel code) |
| Manufacturing Revision | 03-0 |
| Mounting Style | Surface-mount (QFN family) |
| Typical Use Category | Integrated circuit (IC) |
| Lead Finish / Compliance | Refer to manufacturer; check datasheet for RoHS and finish codes |
QCA-8695AU-0-DRQFN130-MT-03-0 Key Features
- High pin count: 130 pins provide greater I/O density for complex system designs and denser PCB routing.
- Low-profile package: DRQFN130 reduces board height and aids compact mechanical integration in stacked assemblies.
- Surface-mount friendly: QFN-style leads and tape-and-reel packaging support automated pick-and-place and standard reflow processes.
- Revision traceability: The 03-0 revision code allows clear revision control and lifecycle tracking in procurement and production.
Typical Applications
- Complex embedded systems requiring high I/O counts and low-profile packages for dense PCB layouts in industrial control units and gateways.
- Modular designs where board space is constrained and assembly uses automated pick-and-place with tape-and-reel packaging for volume manufacturing.
- Development platforms and carrier boards that need a high-pin-count IC for interfacing multiple peripherals, sensors, or power domains.
- Production environments that rely on revision-controlled parts for change management, enabling predictable updates to assemblies and firmware.
QCA-8695AU-0-DRQFN130-MT-03-0 Advantages vs Typical Alternatives
The 130-pin DRQFN format offers denser I/O than many 64- or 100-pin alternatives while keeping a lower profile than BGA or through-hole parts. Surface-mount QFN packages often reduce thermal path length and board area versus larger ceramic packages. Tape-and-reel readiness simplifies high-volume placement and yields faster line throughput. The explicit revision code improves traceability versus generic, non-revisioned SKUs.
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QCA-8695AU-0-DRQFN130-MT-03-0 Brand Info
QCA-prefixed parts are associated with Qualcomm Atheros product families and legacy Atheros silicon lines. The QCA designation indicates a lineage focused on networking and system integration solutions. Use brand documentation and authorized channels for datasheets, qualification details, and lifecycle notices specific to this part number.
FAQ
What is the pin count?
The package code DRQFN130 indicates a 130-pin device. Use this pin count for PCB footprint planning and connector alignment during board design.
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What package does this part use?
DRQFN130 denotes a QFN-style package with exposed thermal pad options typical of DRQFN designs. Verify pad layout from the official datasheet for solder stencil design.
How is it supplied for production?
The MT code in the ordering string commonly refers to tape-and-reel packaging suitable for automated assembly. Confirm reel quantity and packing details with the supplier.
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How do I track revisions?
The trailing 03-0 is a revision or lot identifier. Capture this code in your BOM and incoming inspection records for reliable revision control and traceability.
Where can I find the datasheet?
Obtain the full datasheet and mechanical drawings from the manufacturer or authorized distributor. Use the exact part number to ensure you receive the correct revision and package information.





