QCA-6787AQ-0-NSP334-MT-01-0 Wi-Fi SoC Module (MT-01-0)

QCA-6787AQ-0-NSP334-MT-01-0 Overview

The QCA-6787AQ-0-NSP334-MT-01-0 is a wireless connectivity module designed for embedded networking and IoT applications. It integrates multi-band WLAN and Bluetooth functionality in a compact surface-mount form factor. The module targets designers who need high integration, reduced BOM count, and straightforward RF routing for industrial and consumer deployments. For ordering details and authorized distribution, see IC Manufacturer.

QCA-6787AQ-0-NSP334-MT-01-0 Technical Specifications

QCA-6787AQ-0-NSP334-MT-01-0 Key Features

• Dual-band WLAN ?? Supports 2.4 GHz and 5 GHz to deliver better spectrum flexibility and reduced interference in dense deployments.
• Integrated Bluetooth ?? Adds Classic and BLE support to enable wireless peripherals and low-power sensor links without extra radios.
• Compact module form ?? Reduces PCB area and simplifies RF layout compared to discrete RF components and separate ICs.
• Host interface options ?? SDIO and UART class interfaces enable faster integration with a wide range of application processors and MCUs.
• Industrial temperature range ?? Rated from -40 ??C to +85 ??C for reliable operation in harsh environments.
• Shielded can ?? Provides improved EMI immunity and easier compliance with emissions limits than unshielded designs.

Typical Applications

• Embedded wireless gateways that need concurrent Wi?Fi and Bluetooth links for sensor aggregation and cloud uplinks with consistent RF performance.
• Industrial automation controllers requiring robust 2.4 GHz and 5 GHz connectivity plus BLE for commissioning tools and local device pairing tasks.
• Connected consumer devices where compact PCB footprint and integrated radio functions speed time to market and reduce assembly complexity.
• Point-of-sale and kiosk systems that demand reliable multi-band Wi?Fi for transaction throughput and Bluetooth for accessory connectivity and maintenance.

QCA-6787AQ-0-NSP334-MT-01-0 Advantages vs Typical Alternatives

The module combines multiple wireless functions into a single, shielded surface-mount package. This reduces BOM count and board area versus separate RF chips and discrete front-ends. Compared with discrete solutions, it shortens RF layout time and can lower certification risk thanks to an integrated design. The industrial temperature rating and multi-interface support provide greater deployment flexibility for embedded and commercial products.

QCA-6787AQ-0-NSP334-MT-01-0 Brand Info

The QCA-6787AQ-0-NSP334-MT-01-0 is associated with Qualcomm Atheros product families. Qualcomm Atheros designs wireless connectivity silicon and modules for high-volume embedded markets. The brand emphasizes integrated RF solutions that help OEMs accelerate design cycles and simplify certification.

FAQ

What host interfaces are supported?

The module exposes standard host interfaces such as SDIO for network data and UART for control. These interfaces are common on application processors and simplify driver integration.

Can it operate across both Wi?Fi bands?

Yes. The device supports operation in both 2.4 GHz and 5 GHz bands, allowing deployments to use less-crowded spectrum or higher throughput channels where available.

Is the module suited for outdoor use?

The industrial temperature range supports harsh indoor and sheltered outdoor environments. For direct outdoor exposure, follow enclosure and antenna guidance to ensure reliability and regulatory compliance.

How does shielding help design?

The integrated shielded can improves EMI immunity and simplifies passing emissions testing compared with unshielded RF assemblies. It also reduces sensitivity to PCB layout variations.

What are typical power supply needs?

The module runs from a nominal 3.3 V supply. Designers should follow datasheet recommendations for decoupling and sequencing to minimize noise and ensure stable RF performance.