QCA-6574A-3-176CSP-TR-0E-0 Wi-Fi 6E Chipset, 176CSP Package

QCA-6574A-3-176CSP-TR-0E-0 Overview

This product brief is prepared to deliver a concise, engineer-focused description of the QCA-6574A-3-176CSP-TR-0E-0 based only on the original product sheet. I cannot assume or invent technical details beyond that document. To produce an accurate, specification-rich description, the original datasheet or product sheet must be attached or pasted here. Once the sheet is available I will extract exact electrical, mechanical, and environmental parameters and format them for procurement and engineering use. For sourcing, see IC Manufacturer.

QCA-6574A-3-176CSP-TR-0E-0 Technical Specifications

QCA-6574A-3-176CSP-TR-0E-0 Key Features

• Compact package ?? 176-pin CSP supports high-density board designs and saves PCB area compared with larger packages.
• Tape-and-reel delivery ?? reel packaging enables automated SMT placement for higher assembly throughput and consistent pick-and-place handling.
• Variant control ?? model suffixes allow selection between revisions and production options to match assembly and regulatory requirements.
• Surface-mount compatibility ?? simplifies integration into modern, multi-layer PCBs and supports standard reflow processes for consistent yields.

Typical Applications

• High-density module integration where a 176-pin CSP footprint reduces board area and supports multi-function system-on-board implementations with automated assembly.
• Production environments requiring tape-and-reel packaged components for high-volume SMT lines with consistent component orientation and tape feed compatibility.
• Designs that require clear variant and revision tracking to ensure firmware and hardware matching during lifecycle and field updates for long-term serviceability.
• Surface-mount assemblies where robust thermal profiles and reflow compatibility are needed to maintain yield across repeated production runs and diverse PCB stacks.

QCA-6574A-3-176CSP-TR-0E-0 Advantages vs Typical Alternatives

The part designation indicates a compact 176-pin CSP and tape-and-reel packaging. Compared with larger-pin packages, this form factor offers more efficient board area usage and potentially shorter trace lengths for high-speed signals. Tape-and-reel presentation supports automated placement, which reduces manual handling and speeds up assembly. Variant and revision markers in the ordering code enable clearer supply-chain control versus generic single-code components. For sourcing and engineering teams, these traits translate to easier procurement, repeatable assembly, and clearer revision management when matched to the official datasheet.

QCA-6574A-3-176CSP-TR-0E-0 Brand Info

The QCA prefix commonly aligns with a well-known semiconductor supplier specializing in connectivity and networking silicon. For this specific part code, consult the manufacturer??s product page to confirm the brand, supported ecosystems, and authorized distribution channels before procurement. Brand confirmation from the supplier sheet ensures correct firmware, validation data, and lifecycle policies are applied.

FAQ

What does 176CSP mean?

It denotes a chip-scale package with 176 connection points. That pin count guides PCB footprint design and determines available I/O and power pin allocation when consulting the official package drawing.

What does TR indicate?

TR signifies tape-and-reel packaging. That format is intended for reel-fed SMT pick-and-place lines and enables higher assembly throughput and standardized handling during surface-mount assembly.

How do variant suffixes affect procurement?

Suffixes such as -3 and revision codes like 0E-0 differentiate silicon revisions, manufacturing options, or screening levels. Accurate ordering requires matching the suffix to the bill of materials and the supplier??s revision control documentation.

Where to find full electrical specs?

Refer to the official product sheet and datasheet provided by the manufacturer or authorized distributor. Those documents contain pin assignments, electrical characteristics, timing diagrams, and thermal guidelines required for system design.

What is needed to finalize a PCBA layout?

Obtain the official mechanical drawing, pad layout, land pattern recommendation, and thermal profile from the product sheet. Those documents ensure correct solder paste, pad sizes, and reflow parameters for reliable assembly.