QCA-6574A-3-176CSP-MT-0E-0 Wi-Fi SoC, 176CSP package

QCA-6574A-3-176CSP-MT-0E-0 Overview

The QCA-6574A-3-176CSP-MT-0E-0 is a compact, high-integration semiconductor device supplied in a 176-pin chip-scale package. It targets space-constrained, high-throughput designs where board area and thermal efficiency matter. The part number indicates a 3.3V-class device in a 176CSP footprint and a multi-terminate (MT) mounting variant. For procurement and authorized distribution, refer to IC Manufacturer.

QCA-6574A-3-176CSP-MT-0E-0 Technical Specifications

QCA-6574A-3-176CSP-MT-0E-0 Key Features

• High integration ?? 176-pin CSP reduces board area compared with larger packages while retaining full I/O availability.
• 3.3 V supply class ?? aligns with common system rails, simplifying power sequencing and reducing BOM complexity.
• Industrial temperature support ?? rated for -40 to +85 ??C for reliable operation in harsher environments.
• Surface-mount CSP ?? enables automated assembly and denser PCB layouts for modern compact modules.

Typical Applications

• Embedded communications modules where a 176-pin CSP provides more I/O and saves board area compared with larger BGA or LQFP packages, for compact wireless gateways.
• Industrial control units that require a 3.3 V-class device with extended temperature range and high pin count to support multiple peripheral interfaces.
• High-density networking appliances that need a small package for constrained enclosures while maintaining signal routing and thermal performance.
• Custom system-on-module designs where the MT variant supports module-level mounting and simplifies integration into third-party carrier boards.

QCA-6574A-3-176CSP-MT-0E-0 Advantages vs Typical Alternatives

The 176-pin chip-scale package offers a balance of pin count and compact footprint compared with larger BGA options. The 3.3 V nominal operation simplifies integration into standard power domains versus parts requiring multiple, uncommon rails. The surface-mount CSP form factor reduces board area and can lower parasitics versus through-hole or larger-package alternatives. The specified operating range to +85 ??C supports broader industrial use than consumer-only-rated components.

QCA-6574A-3-176CSP-MT-0E-0 Brand Info

The QCA-6574A-3-176CSP-MT-0E-0 designation follows the established naming convention used by the part family owner. The label highlights the 6574A device family, a 3.3 V variant, and the 176CSP mechanical format. Sourcing through authorized distributors ensures traceability, compliance, and access to variant-specific documentation.

FAQ

What is the package pin count?

The device uses a 176-pin chip-scale package (CSP), providing a high number of I/Os in a reduced footprint suitable for dense PCB layouts and module integration.

What supply voltage is required?

The product listing indicates a 3.3 V nominal supply class, which matches common system rails and reduces the need for additional power converters on the board.

What operating temperatures are supported?

The specified operating range covers -40 to +85 ??C, enabling deployment in temperature-challenging industrial and outdoor applications within that bracket.

How is the part mounted to the PCB?

The 176CSP is a surface-mount package. The MT suffix denotes a mounting variant optimized for module or multi-termination assembly methods on carrier boards.

Where should I buy this part?

Purchase through authorized distribution channels or the manufacturer’s approved partners to ensure genuine parts, factory traceability, and access to documentation and qualification data.