QCA-6436-0-NSP170B-MT-01-0 Wi-Fi/Bluetooth Combo Module (MT Package)

QCA-6436-0-NSP170B-MT-01-0 Overview

The QCA-6436-0-NSP170B-MT-01-0 is a wireless connectivity IC optimized for compact, high-throughput embedded designs. It targets dual-band Wi?Fi integration with low-latency data paths and power-efficient operation for battery-powered or thermally constrained systems. Designers will value the smaller footprint, multi-gigabit host interfaces, and support for common antenna configurations. For sourcing and manufacturer details, visit IC Manufacturer.

QCA-6436-0-NSP170B-MT-01-0 Technical Specifications

QCA-6436-0-NSP170B-MT-01-0 Key Features

• Dual-band Wi?Fi enabling higher throughput and reduced interference on congested 2.4 GHz and 5 GHz bands.
• 2??2 MIMO support to increase link reliability and deliver up to 2?? the spatial streams compared with single?antenna designs.
• PCIe host interface for low-latency, high-bandwidth connection to application processors and network controllers.
• Compact QFN package that simplifies board layout and reduces BOM size for space-constrained industrial modules.

Typical Applications

• Embedded wireless modules for industrial IoT gateways where robust dual-band connectivity and compact board area are required for long-term field operation.
• Consumer and commercial access points that need a 2??2 client radio with PCIe host connectivity to offload traffic to main SoCs.
• Automated test equipment and instrumentation that require deterministic low-latency Wi?Fi links in both 2.4 GHz and 5 GHz environments.
• Smart appliances and building automation nodes where power efficiency, small package size, and reliable MIMO links improve user experience and system uptime.

QCA-6436-0-NSP170B-MT-01-0 Advantages vs Typical Alternatives

Compared with single-band or single?antenna solutions, this device delivers stronger throughput and better interference resilience via dual-band operation and 2??2 MIMO. The integrated PCIe interface provides higher sustained host bandwidth than many SDIO-based radios, making it better suited for throughput-sensitive designs. Its compact QFN package reduces PCB area versus larger module alternatives while maintaining similar RF performance and compliance.

QCA-6436-0-NSP170B-MT-01-0 Brand Info

QCA-6436-0-NSP170B-MT-01-0 is identified with the Qualcomm Atheros family, a widely used brand for wireless SoCs. Qualcomm Atheros products focus on radio performance, software ecosystem support, and broad industry adoption for networking. The brand voice emphasizes connectivity performance, integration flexibility, and long-term supply availability.

FAQ

What interface does it use?

The device uses a high-speed host interface, implemented as PCIe Gen2 x1, to connect to application processors and network controllers for low-latency data transfer.

Which frequency bands are supported?

It supports both 2.4 GHz and 5 GHz frequency bands, enabling flexible deployment in dense Wi?Fi and mixed-environment scenarios for higher aggregate throughput.

How many spatial streams are available?

The radio supports a 2??2 MIMO antenna configuration, providing two spatial streams to improve throughput and link robustness compared to single-stream radios.

What package should I expect?

The component ships in a compact QFN package suitable for surface-mount assembly; this reduces BOM space and supports automated manufacturing processes.

Is it suitable for industrial temperatures?

Yes. The device operates across a wide temperature range from -40 ??C to +85 ??C, making it suitable for many industrial and outdoor applications.