QCA-6426-0-118NSP-TR-01-0 Overview
This component is a board-level semiconductor device offered in a factory-prepared shipping format. It is intended for engineers and sourcing specialists who need a compact, assembly-ready part for automated production and procurement. Documentation and packaging formats are designed to support standard pick-and-place processes and inventory control. For further manufacturer and ordering details consult IC Manufacturer
QCA-6426-0-118NSP-TR-01-0 Technical Specifications
| Part Number | QCA-6426-0-118NSP-TR-01-0 |
| Device Type | Semiconductor component intended for board-level installation |
| Package Type | Surface-mount compatible package suitable for automated assembly |
| Packaging Method | Factory-ready packaging to support supply chain handling and automated placement |
| Mounting Style | SMD / surface-mount for standard printed circuit board assembly |
| Compliance | Manufacturing and distribution practices aligned with industry environmental and safety guidelines |
| Storage and Handling | Packaged to mitigate moisture and handling damage during distribution and automated processing |
| Documentation | Datasheet, packaging, and ordering details available from supplier resources |
| Typical Use | Integration into electronic assemblies where component-level procurement and automated placement are required |
| Ordering Unit | Supplied in quantity units optimized for production and inventory management |
QCA-6426-0-118NSP-TR-01-0 Key Features
- Compact, surface-mount package for efficient board-level integration, reducing board space and easing layout constraints.
- Factory-oriented packaging that supports automated pick-and-place processes, improving manufacturing throughput and yield.
- Documentation and format aimed at standard supply-chain workflows, facilitating procurement and inventory traceability.
- Designed for compatibility with common PCB assembly lines, lowering qualification time for production and enabling predictable assembly performance.
QCA-6426-0-118NSP-TR-01-0 Advantages vs Typical Alternatives
This part offers a production-ready form factor that simplifies sourcing and assembly. Compared with bulk or non-standard packaged alternatives, it reduces handling steps and helps maintain consistent placement and orientation during automated assembly. The packaging and documentation approach also support supplier traceability and efficient stock management, which is valuable for engineering and procurement teams.
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Typical Applications
- Integration into industrial control boards where a surface-mount semiconductor part is required for reliable automated assembly and consistent placement accuracy across production runs.
- Sourcing for high-volume electronics manufacturing where standardized packaging and documentation reduce procurement complexity and support JIT inventory practices.
- Replacement or upgrade programs in legacy systems that require board-level compatible parts with controlled packaging to match existing assembly processes and quality procedures.
- Prototyping and pilot production phases where engineering teams need a component delivered in a format that mirrors expected mass-production packaging and handling.
QCA-6426-0-118NSP-TR-01-0 Brand Info
FAQ
How is this part packaged?
The part is supplied in a factory-prepared packaging format intended for automated handling. Packaging is optimized to protect the component during shipping and to support pick-and-place equipment. Refer to supplier packing documentation for exact carrier and tape configurations before production planning.
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Where can I find the datasheet?
Datasheet and technical documents are provided by the authorized distributor or the component supplier. Consult the supplier resource portal or your authorized distributor to obtain the full datasheet, mechanical drawings, and recommended land pattern.
Is this component suitable for surface-mount assembly?
Yes. The device is presented in a surface-mount compatible package and is intended for board-level SMD assembly. Verify recommended soldering profiles and PCB footprint details in the supplier documentation to ensure correct assembly and reflow results.
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What procurement information should I verify?
Confirm ordering codes, minimum order quantities, packaging format, lead times, and any lot traceability or date code requirements with your supplier. Check for available compliance and qualification documentation to meet your internal sourcing policies.
How do I handle storage and moisture sensitivity?
Follow supplier guidance for storage and handling to avoid moisture-related issues common to surface-mount components. Use recommended dry storage and observe any floor-life and baking instructions provided in the packing documentation prior to assembly.
