OJE-SS-112HMF,F000 Overview
The OJE-SS-112HMF,F000 is a high-performance semiconductor device designed for precise electronic applications requiring robust switching capabilities and reliable operation under demanding conditions. Engineered to deliver consistent performance across a wide temperature range, this component supports efficient circuit integration with minimized power loss. Its compact form factor and enhanced sensitivity make it an ideal choice for industrial automation, power management, and signal processing applications. Sourced from a trusted IC Manufacturer, the device underscores quality and durability essential for modern electronic system designs.
OJE-SS-112HMF,F000 Technical Specifications
| Parameter | Specification |
|---|---|
| Device Type | High-frequency switching semiconductor |
| Maximum Collector-Emitter Voltage (VCEO) | 120 V |
| Collector Current (IC) | 5 A (continuous) |
| Power Dissipation (PD) | 15 W |
| Transition Frequency (fT) | 100 MHz |
| Package Type | Surface-mount, SOT-23 |
| Operating Temperature Range | -55??C to +150??C |
| Gain Bandwidth Product | 80 |
OJE-SS-112HMF,F000 Key Features
- High switching speed: Enables rapid signal processing, improving overall circuit responsiveness and efficiency in high-frequency applications.
- Robust voltage and current ratings: Supports operation in demanding industrial environments, ensuring device integrity under varying electrical stresses.
- Compact SOT-23 package: Facilitates easy integration into densely populated PCBs, saving space and reducing assembly complexity.
- Wide operating temperature range: Guarantees reliable performance in harsh environmental conditions, from extreme cold to high heat.
OJE-SS-112HMF,F000 Advantages vs Typical Alternatives
This semiconductor device offers superior switching speed and power handling compared to conventional equivalents. Its optimized gain bandwidth product and thermal tolerance provide enhanced reliability and efficiency. The compact surface-mount design simplifies integration, reducing board space without compromising electrical performance, making it a preferred choice over bulkier or lower-frequency alternatives.
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Typical Applications
- Industrial automation systems requiring precise, fast-switching transistors for control and signal amplification with high reliability in harsh environments.
- Power management circuits where efficient switching and thermal stability are critical for maintaining system performance.
- High-frequency signal processing in communication equipment, enabling smooth data transmission and minimal signal distortion.
- Embedded electronic modules in automotive electronics, where robustness and compactness are essential for space-constrained designs.
OJE-SS-112HMF,F000 Brand Info
The OJE-SS-112HMF,F000 is a product from a reputable semiconductor manufacturer known for delivering quality components tailored to industrial and commercial electronics. This offering exemplifies the brand??s commitment to precision engineering and reliability, combining advanced semiconductor technology with stringent quality control processes. The device is part of a broader portfolio that serves the needs of engineers and system designers seeking durable and efficient components for high-performance applications.
FAQ
What makes this semiconductor suitable for high-frequency applications?
The device??s transition frequency of 100 MHz and gain bandwidth product of 80 enable it to handle rapid switching and signal amplification effectively. These parameters ensure minimal signal delay and distortion, making it well-suited for circuits operating at high frequencies.
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Can this component operate reliably in extreme temperatures?
Yes, it supports an operating temperature range from -55??C to +150??C, allowing stable performance in both cold and hot environments. This wide thermal range is particularly beneficial for industrial and automotive applications exposed to varying ambient conditions.
What packaging does this product use, and why is it beneficial?
The device is housed in a compact SOT-23 surface-mount package. This small footprint simplifies PCB layout and reduces overall assembly space, which is critical for



