NT4H2421TSDUD/020Z Overview
The NT4H2421TSDUD/020Z is a high-performance semiconductor device designed for advanced industrial and consumer electronics applications. Featuring a dual-core architecture and optimized for low power consumption, it enables efficient processing and enhanced system reliability. This component is ideal for integration into complex electronic systems requiring stable operation across a broad temperature range. Its compact package and robust electrical characteristics support seamless implementation in space-constrained designs. For detailed technical support and purchasing options, visit IC Manufacturer.
NT4H2421TSDUD/020Z Technical Specifications
| Parameter | Specification |
|---|---|
| Core Architecture | Dual-core processing unit |
| Operating Voltage | 2.7 V to 3.6 V |
| Maximum Clock Frequency | 120 MHz |
| Package Type | TSOP (Thin Small Outline Package) |
| Operating Temperature Range | -40??C to +85??C |
| Memory Size | 2 MB embedded flash |
| Power Consumption | Typical 50 mW at 100 MHz |
| I/O Pins | 32 configurable GPIOs |
| Communication Interfaces | SPI, I2C, UART |
NT4H2421TSDUD/020Z Key Features
- Dual-core processing: Enables parallel task execution, improving system throughput and responsiveness in demanding industrial applications.
- Wide voltage range support: Operates efficiently between 2.7 V and 3.6 V, ensuring compatibility with various power supply designs.
- Low power consumption: Designed for energy-efficient operation, reducing heat dissipation and extending device longevity in embedded systems.
- Robust temperature tolerance: Suitable for harsh environments with reliable performance from -40??C to +85??C.
- Multiple communication interfaces: Supports SPI, I2C, and UART protocols, facilitating flexible integration into diverse electronic architectures.
- Compact TSOP packaging: Enables space-saving PCB layouts without compromising thermal management.
- Extensive GPIO availability: Provides 32 configurable pins for versatile peripheral connectivity and control.
NT4H2421TSDUD/020Z Advantages vs Typical Alternatives
This device offers superior integration with dual-core processing and multiple communication protocols, enhancing system efficiency compared to typical single-core alternatives. Its low power consumption and wide operating voltage range provide greater design flexibility and reliability under varied operating conditions. The compact TSOP package supports high-density PCB designs, making it a preferred choice for engineers prioritizing space and performance.
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Typical Applications
- Embedded control systems in industrial automation, requiring robust processing power and reliable communication interfaces for real-time data handling.
- Consumer electronics devices that demand low power consumption and compact size for portable and battery-operated products.
- IoT modules where efficient multi-interface connectivity and extended temperature range are critical for outdoor or industrial networking nodes.
- Automotive electronics applications that benefit from durable operation across a broad temperature spectrum and precise control capabilities.
NT4H2421TSDUD/020Z Brand Info
This component is part of a comprehensive semiconductor portfolio from a leading IC manufacturer known for delivering high-quality, reliable solutions tailored to industrial and consumer markets. The product line emphasizes innovation in embedded processing and connectivity, supporting next-generation electronic designs. The NT4H2421TSDUD/020Z exemplifies the brand??s commitment to performance, efficiency, and integration, backed by rigorous quality control and technical support services.
FAQ
What supply voltage range does this device support?
The device operates within a supply voltage range of 2.7 V to 3.6 V, allowing compatibility with commonly used power sources in embedded and industrial systems. This flexibility supports stable operation and efficient power management.
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Which communication protocols are available on this product?
It supports several standard communication interfaces including SPI, I2C, and UART. These protocols enable seamless integration with various sensors, memory devices, and external modules, providing versatile connectivity options.
What is the maximum clock frequency for this component?
The maximum clock frequency is 120 MHz, which balances processing speed with power consumption to suit a wide range of application requirements, from simple control tasks to more demanding processing loads.
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How does the thermal performance stand up in harsh environments?
The device is rated for operation from -40??C to +85??C, making it suitable for industrial and automotive environments where temperature extremes are common. This ensures reliable performance without degradation under stress conditions.
What packaging options are available for this semiconductor?
This product is offered in a Thin Small Outline Package (TSOP), which is a compact form factor that facilitates high-density PCB designs while maintaining good thermal dissipation characteristics. This packaging supports efficient manufacturing and integration.
