NT3H2211W0FT1X NFC Tag IC with I2C Interface – SO8 Package

  • This device enables contactless NFC tag functionality, allowing seamless wireless data exchange with compatible readers.
  • It supports a memory capacity suitable for storing essential user data, ensuring efficient information management.
  • The compact package type contributes to board-space savings, facilitating integration into small or space-constrained designs.
  • Ideal for access control applications, it simplifies secure authentication by storing identification credentials.
  • Manufactured with quality controls to ensure reliable operation in various environmental conditions over time.
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产品上方询盘

NT3H2211W0FT1X Overview

The NT3H2211W0FT1X is a high-performance NFC Forum Type 2 Tag IC designed to enable seamless short-range wireless communication in embedded systems. This device integrates a 2-kilobyte user memory, allowing secure and flexible data storage for applications requiring contactless data exchange. Its I2C interface supports efficient microcontroller communication, while the integrated energy harvesting feature enables power delivery from the NFC field. With a compact form factor and robust compliance to NFC Forum standards, it is ideal for industrial and consumer electronics that demand reliable, low-power NFC functionality. For detailed sourcing and technical support, visit IC Manufacturer.

NT3H2211W0FT1X Technical Specifications

Parameter Specification
Memory Size 2048 bytes user memory
Communication Interface NFC Forum Type 2 Tag, I2C Slave
Operating Voltage 2.7 V to 5.5 V
Operating Frequency 13.56 MHz (NFC HF band)
Energy Harvesting Integrated energy harvesting with output voltage up to 3.3 V
Data Retention 10 years minimum
Endurance 100,000 write cycles minimum
Package Type WLCSP-20 (0.4 mm pitch)
Operating Temperature Range -25 ??C to +85 ??C

NT3H2211W0FT1X Key Features

  • Large User Memory: Offers 2 kB of user memory to store custom data, enabling versatile applications such as secure digital tags or configuration storage.
  • Dual Interface Capability: Supports NFC wireless communication and I2C connectivity, facilitating seamless interaction between NFC readers and embedded microcontrollers.
  • Integrated Energy Harvesting: Converts NFC field energy into a usable power supply (up to 3.3 V), reducing battery dependency and enhancing device autonomy.
  • Robust Data Retention and Endurance: Guarantees a minimum of 10 years data retention and 100,000 write cycles, ensuring long-term reliability in industrial environments.
  • Compact WLCSP Package: Enables space-saving PCB designs, critical for compact electronics and wearable devices.
  • Wide Operating Voltage Range: Functions efficiently from 2.7 V to 5.5 V, compatible with various system power domains.
  • Compliant with NFC Forum Type 2 Standards: Ensures interoperability with a broad range of NFC-enabled smartphones and readers, streamlining integration.

NT3H2211W0FT1X Advantages vs Typical Alternatives

This NFC tag IC distinguishes itself by combining a sizable 2 kB user memory with energy harvesting capabilities, unlike typical tags that offer limited memory and no power output. Its dual interface (NFC and I2C) provides seamless integration with embedded systems, enhancing communication flexibility. The device??s extended data retention and endurance guarantee long-term stability, while the compact WLCSP package supports miniaturized designs. Together, these advantages make it a superior choice for industrial and consumer applications requiring reliable, low-power NFC solutions.

Typical Applications

  • Access control systems: Stores user credentials and communicates wirelessly with readers, enabling secure and contactless authentication in industrial and commercial environments.
  • Smart posters and marketing: Embeds rich information or URLs accessible via NFC-enabled smartphones for interactive consumer engagement.
  • Asset tracking and inventory management: Facilitates real-time asset identification and data updates through NFC-enabled devices and microcontrollers.
  • Wearable electronics: Integrates compactly to provide wireless data exchange and energy harvesting for extended autonomy in health and fitness devices.

NT3H2211W0FT1X Brand Info

This product is part of a renowned portfolio of NFC Forum-compliant tag ICs designed to meet the evolving demands of embedded wireless communication. Engineered with precision, it offers high reliability and compatibility across various NFC ecosystems. Its development focuses on delivering robust performance, ease of integration, and energy-efficient operation, reflecting the brand??s commitment to innovation in industrial-grade semiconductor solutions.

FAQ

What type of memory does this NFC tag provide, and how much storage is available?

The device includes 2 kilobytes of user memory organized as EEPROM, which allows non-volatile storage of data accessible via NFC or I2C interfaces. This capacity supports complex data structures and multiple application use cases.

How does the energy harvesting feature function in this NFC tag?

The integrated energy harvesting circuit converts the RF energy from the NFC field into a DC output voltage up to 3.3 V. This supply can power external circuitry, reducing dependence on batteries or external power sources in certain applications.

What communication protocols does this device support for interfacing?

It supports two main communication methods: contactless NFC Forum Type 2 Tag protocol at 13.56 MHz and a wired I2C slave interface. This dual communication capability enables flexible integration with NFC readers and embedded microcontrollers.

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产品中间询盘

What are the endurance and data retention specifications for this NFC tag IC?

The memory guarantees a minimum of 100,000 write cycles and data retention for at least 10 years. These specifications ensure the device remains reliable for long-term deployment in industrial or consumer electronics.

What packaging options are available, and what are their benefits?

The device is provided in a WLCSP-20 package with a fine 0.4 mm pitch. This wafer-level chip-scale package minimizes PCB footprint, supports high-density designs, and is suitable for compact, space-constrained applications such as wearables and portable devices.

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