MX47039SF2 Overview
The MX47039SF2 is a high-performance semiconductor designed for precision industrial applications requiring robust signal processing and stable operation. Featuring advanced integration and optimized electrical characteristics, it supports efficient power management and reliable data throughput. This component is well-suited for demanding environments where accuracy and durability are critical. Engineers and sourcing specialists will benefit from its compact form factor and broad operating conditions, ensuring seamless integration into complex systems. For further technical insights and sourcing details, visit IC Manufacturer.
MX47039SF2 Technical Specifications
| Parameter | Specification |
|---|---|
| Operating Voltage | 3.3 V ?? 5% |
| Maximum Operating Temperature | +85??C |
| Minimum Operating Temperature | -40??C |
| Package Type | QFN 32-pin |
| Data Transfer Rate | Up to 50 Mbps |
| Power Consumption | Max 150 mW |
| Input Signal Range | 0?C5 V |
| ESD Protection | ??4 kV HBM |
| Output Type | Push-Pull |
| Supply Current | 40 mA typical |
MX47039SF2 Key Features
- High-speed data transfer: Supports up to 50 Mbps, enabling rapid communication in time-sensitive industrial systems.
- Wide operating temperature range: Functionality from -40??C to +85??C ensures reliable performance in harsh environments.
- Low power consumption: Maximum 150 mW power use reduces energy costs and thermal load in compact assemblies.
- Robust ESD protection: ??4 kV Human Body Model rating enhances device longevity and system stability.
- Compact QFN 32-pin package: Minimizes PCB footprint and facilitates high-density board layouts for modern industrial designs.
- Push-pull output stage: Delivers strong drive capability with reduced signal distortion for improved signal integrity.
- Stable supply current: Typical current at 40 mA supports consistent operation with predictable power budgeting.
MX47039SF2 Advantages vs Typical Alternatives
This device offers superior sensitivity and operational accuracy compared to typical alternatives, particularly in industrial signal processing roles. Its low power consumption combined with enhanced ESD protection improves system reliability and reduces total cost of ownership. The integrated push-pull output and compact package enable easier integration and better thermal management in dense system environments.
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Typical Applications
- Industrial automation control systems requiring precise and high-speed data communication under wide temperature variations.
- Power management modules in energy-efficient industrial equipment where low power and stable operation are critical.
- Signal conditioning circuits that demand high immunity to electrostatic discharge and noise.
- Embedded sensor interfaces in harsh environments, leveraging the device??s robust packaging and temperature tolerance.
MX47039SF2 Brand Info
The MX47039SF2 is a flagship product from a leading semiconductor manufacturer specializing in industrial-grade integrated circuits. Designed to meet stringent industrial standards, this product embodies the brand??s commitment to quality, reliability, and performance. It exemplifies the manufacturer??s expertise in creating components that seamlessly integrate into complex industrial systems, supporting next-generation automation and control technologies.
FAQ
What is the maximum operating temperature of the MX47039SF2?
The maximum operating temperature for this device is +85??C, making it suitable for a wide range of industrial environments where elevated temperatures are common. This ensures consistent functionality without thermal degradation.
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What package type is used for the MX47039SF2?
The device is housed in a compact QFN 32-pin package. This package type offers a reduced footprint and excellent thermal dissipation properties, ideal for high-density PCB designs in industrial applications.