MX34A18SFA Overview
The MX34A18SFA is a high-performance semiconductor device designed for advanced industrial and electronic applications. Featuring a robust architecture optimized for reliability and precision, this component ensures stable operation in demanding environments. It supports efficient data handling and processing, making it ideal for complex system integrations. Designed with industry standards in mind, the MX34A18SFA offers engineers and sourcing specialists a reliable solution that balances power consumption and operational speed. For detailed technical details and purchasing options, visit IC Manufacturer.
MX34A18SFA Technical Specifications
| Parameter | Specification |
|---|---|
| Operating Voltage | 2.7 V to 3.6 V |
| Data Transfer Rate | Up to 166 MHz |
| Memory Density | 18 Megabits |
| Package Type | 48-pin TSOP |
| Operating Temperature Range | -40??C to +85??C |
| Access Time | 70 ns |
| Power Consumption (Active) | 60 mA typical |
| Interface | Asynchronous SRAM |
MX34A18SFA Key Features
- Asynchronous SRAM interface enables seamless integration with microcontrollers and processors, reducing system complexity and enhancing data throughput.
- Wide operating voltage range from 2.7 V to 3.6 V ensures compatibility with various power supply designs, improving design flexibility.
- Low power consumption during active operation contributes to energy-efficient designs, extending device longevity and reducing heat generation.
- Robust temperature tolerance supports reliable performance in industrial environments ranging from -40??C to +85??C, ensuring system stability.
- Compact 48-pin TSOP package optimizes board space, facilitating high-density PCB layouts and streamlined manufacturing processes.
MX34A18SFA Advantages vs Typical Alternatives
This semiconductor device offers superior reliability and integration ease compared to typical SRAM components. Its broad voltage compatibility and low active power consumption make it well-suited for efficient industrial electronics. The extended temperature range ensures consistent performance under harsh conditions, while the compact TSOP package supports high-density circuit designs. Together, these advantages facilitate enhanced system accuracy, sensitivity, and operational stability over many conventional alternatives.
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Typical Applications
- Embedded system memory storage where fast access times and low power consumption are critical for performance and energy efficiency in industrial automation.
- Buffer memory in telecommunications equipment requiring reliable data handling and quick response under variable environmental conditions.
- Data caching in high-speed computing systems, ensuring rapid data availability with minimal latency.
- Industrial control systems demanding robust memory solutions capable of sustained operation across wide temperature ranges.
MX34A18SFA Brand Info
The MX34A18SFA is developed and distributed by a globally recognized semiconductor manufacturer known for delivering high-quality integrated circuits tailored for industrial and commercial markets. This product exemplifies the brand’s commitment to innovation, durability, and performance, with extensive support for engineers seeking reliable memory solutions. The brand’s rigorous quality control and adherence to industry standards ensure that the MX34A18SFA meets stringent requirements for modern electronic design.
FAQ
What is the memory density and how does it impact system design?
The device offers an 18 Megabit memory density, providing ample storage capacity for mid-range embedded systems. This density supports efficient data buffering and caching, reducing the need for external memory components and simplifying system architecture.
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What voltage ranges does the MX34A18SFA support?
It operates within a voltage range of 2.7 V to 3.6 V. This wide range allows compatibility with standard 3.3 V power supplies commonly used in industrial electronics and embedded applications, offering design versatility.
How does the package type influence PCB layout?
The 48-pin Thin Small Outline Package (TSOP) minimizes the board footprint while maintaining accessible pin configuration. This facilitates higher density PCB designs and efficient space utilization in compact



