MX31035SGD Overview
The MX31035SGD is a high-performance integrated circuit designed for precision and reliability in industrial electronic applications. Engineered by IC Manufacturer, this component offers robust functionality with optimized power consumption and enhanced signal processing capabilities. Its compact form factor and comprehensive technical specifications make it ideal for demanding environments where accuracy and efficiency are critical. The device??s advanced design supports seamless integration into complex systems, ensuring consistent performance across a wide temperature range and voltage conditions.
MX31035SGD Technical Specifications
| Parameter | Specification |
|---|---|
| Supply Voltage Range | 3.0 V to 3.6 V |
| Operating Temperature | -40??C to +85??C |
| Input Current | Max 5 mA |
| Output Type | Open-Drain |
| Data Interface | I2C compatible |
| Package Type | SOP-8 |
| Resolution | 12-bit |
| Response Time | 10 ms (typical) |
| Power Consumption | Low power mode supported |
MX31035SGD Key Features
- High-resolution 12-bit output: Enables precise measurement and control, improving system accuracy in sensor applications.
- Wide operating voltage range: Facilitates compatibility with various power sources, enhancing design flexibility for engineers.
- Low power consumption: Supports extended operation in battery-powered or energy-sensitive systems without compromising performance.
- Standard I2C interface: Allows easy integration into existing communication protocols, reducing development time and complexity.
MX31035SGD Advantages vs Typical Alternatives
This device offers superior sensitivity and accuracy compared to typical alternatives by providing a higher resolution and lower noise output. Its low power consumption and robust operating temperature range make it particularly reliable for industrial environments. The standard I2C interface simplifies system integration, while the compact SOP-8 package optimizes board space, delivering a balanced solution for demanding applications.
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Typical Applications
- Industrial sensor systems requiring precise analog-to-digital conversion for monitoring and control in harsh environments.
- Embedded systems where low power consumption and reliable communication protocols are essential.
- Automated manufacturing equipment demanding consistent signal accuracy for quality assurance processes.
- Data acquisition modules that benefit from compact form factor and easy I2C interfacing for seamless integration.
MX31035SGD Brand Info
Manufactured by a reputable industry leader, the MX31035SGD reflects a commitment to quality and innovation in semiconductor solutions. The product line is developed with a focus on meeting stringent industrial standards, ensuring durability and performance stability. This integrated circuit is part of a broader portfolio tailored to address complex electronic challenges, backed by comprehensive technical support and extensive documentation.
FAQ
What is the typical supply voltage for the MX31035SGD?
The device operates reliably within a supply voltage range of 3.0 V to 3.6 V. This range ensures stable performance across standard industrial power rails and supports common voltage levels used in embedded systems.
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Does the MX31035SGD support any communication protocols?
Yes, it supports the I2C communication protocol, which is widely used for device interfacing in industrial and embedded applications. This compatibility simplifies integration into existing system architectures.
What temperature range can the MX31035SGD operate within?
The component is rated for operation from -40??C up to +85??C, making it suitable for a wide variety of industrial environments that experience significant temperature variations.
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How does the MX31035SGD contribute to low power applications?
It features low power consumption modes that help extend battery life or reduce energy use in systems where power efficiency is critical, without sacrificing accuracy or responsiveness.
What package type is used for the MX31035SGD and why is it beneficial?
The device is housed in a SOP-8 package, which offers a compact footprint ideal for space-constrained designs. This package also ensures reliable thermal performance and ease of PCB assembly, supporting efficient manufacturing processes.