MSPM0G3507SRHBR Power Management IC (PMIC)

MSPM0G3507SRHBR Overview

The MSPM0G3507SRHBR is a compact power-semiconductor device optimized for low-voltage, high-efficiency switching in space-constrained industrial designs. It targets engineers and sourcing specialists who need reliable surface-mount components with predictable thermal and electrical behavior. The device is supplied in a standard automated-friendly format for high-volume placement. Use this listing to assess fit, thermal margins, and PCB layout trade-offs when comparing alternative parts from suppliers. For manufacturer details and certified documentation visit IC Manufacturer.

MSPM0G3507SRHBR Technical Specifications

MSPM0G3507SRHBR Key Features

• Low on-resistance for reduced conduction losses and improved power efficiency in tight thermal budgets.
• High blocking voltage relative to low-voltage alternatives, enabling wider headroom in 12?C24 V systems.
• Compact SOT-23 packaging which simplifies PCB real estate trade-offs and supports automated assembly at scale.
• Single-channel N?channel topology that integrates easily into synchronous buck, load-switch, and reverse-polarity protection circuits.

Typical Applications

• Switching elements in DC?CDC converters for industrial control modules where compact size and thermal performance matter across continuous duty cycles.
• Load switches and power gating in distributed power systems where lower Rds(on) reduces I2R losses and improves overall system efficiency.
• Motor-drive predrivers and low-voltage switching stages in factory automation systems that require robust devices for transient and steady-state currents.
• Battery management and power-path control in backup and UPS subsystems where surface-mount placement and automated assembly are prioritized.

MSPM0G3507SRHBR Advantages vs Typical Alternatives

The MSPM0G3507SRHBR combines a moderate blocking voltage with a comparatively low on-resistance and a small SMT package. Compared with larger through-hole or higher-Rds(on) parts, it delivers lower conduction losses and reduced PCB area, which improves energy density. Compared with ultra-low-Rds(on) devices in larger packages, it offers better placement density and simpler thermal coupling on small boards. These factors make it a balanced choice for engineers prioritizing a trade-off between thermal performance, board area, and automated assembly compatibility.

MSPM0G3507SRHBR Brand Info

The MSPM0G3507SRHBR is listed under a recognized semiconductor supplier known for discrete power MOSFETs and ICs. The brand focuses on high-volume manufacturability, industry-standard packaging, and robust supply-chain documentation. Engineering support emphasizes datasheet traceability, reel and tape options, and lifecycle management for industrial customers.

FAQ

What package does it use?

The device is supplied in a small surface-mount package (3-pin SOT-23 style) suitable for automated pick-and-place assembly and reflow soldering on standard PCB finishes.

Is this part RoHS compliant?

RoHS and similar compliance are typically documented on the manufacturer datasheet and packing slips; sourcing specialists should verify compliance certificates in the official part documentation.

How should thermal layout be handled?

Designers should route a short low-impedance copper plane to the drain pad, include thermal vias where possible, and follow the manufacturer??s PCB footprint recommendations to maintain junction temperatures within specified limits.

What test data should I request?

Request the full datasheet including typical Rds(on) vs. gate voltage curves, Safe Operating Area (SOA), switching characteristics, and thermal resistance (R??JA) to validate performance in your application.

How is it supplied for production?

Commercial quantities are normally supplied on tape and reel suitable for automated assembly. Confirm the tape orientation and reel quantity with the supplier to match your pick-and-place workflow.