MSP430G2230IDR 16-bit Low-Power Microcontroller SOIC Package

  • Low-power MCU core provides simple control and long battery life for portable sensor nodes.
  • Efficient instruction set and low active current reduce power draw, extending device runtime significantly.
  • Small package enables compact PCB designs, saving board space and simplifying enclosure integration.
  • In battery-powered temperature logging, MSP430G2230IDR minimizes sampling overhead while maximizing months-long operation.
  • Processed under rigorous QA and industry testing standards to ensure consistent behavior under field conditions.
SKU: MSP430G2230IDR Category: Brand:
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产品上方询盘

MSP430G2230IDR Overview

The MSP430G2230IDR description below is intentionally constrained to rely only on the authoritative datasheet or sheet you referenced. To ensure accuracy and avoid invented specifications, I need the referenced sheet to extract all electrical, mechanical and timing values directly. Once the sheet is supplied, I will produce a complete, sourced product description that includes precise numerical specifications, a rich technical table, definitive features with measured benefits, concrete application examples, and a comparison to typical alternatives. For sourcing and purchasing context, see IC Manufacturer.

MSP430G2230IDR Technical Specifications

Parameter Value (from supplied sheet)
Core architecture To be taken from the provided sheet
Maximum clock frequency To be taken from the provided sheet
On-chip Flash memory To be taken from the provided sheet
On-chip RAM To be taken from the provided sheet
Operating voltage range To be taken from the provided sheet
Number of I/O pins To be taken from the provided sheet
Analog peripherals (ADC channels / resolution) To be taken from the provided sheet
Timers / communication peripherals To be taken from the provided sheet
Package type and pins To be taken from the provided sheet
Typical active and standby currents To be taken from the provided sheet

MSP430G2230IDR Key Features

  • One core capability: 16?bit RISC processing (confirmation and exact clock rate will be sourced from the sheet), which enables efficient control code execution.
  • Low power modes plus small active current (exact currents listed in sheet), reducing energy use in battery?powered designs.
  • Integrated peripherals that simplify system design and reduce PCB area versus discrete alternatives, improving integration and reliability.
  • On-chip nonvolatile memory and RAM (capacities confirmed by the sheet) for compact firmware and data storage without external components.

Typical Applications

  • Battery?powered sensor nodes and wireless endpoints where low standby and active currents extend device life across long deployments and reduce maintenance intervals.
  • Simple user interfaces and control panels that need a small MCU with integrated timers, GPIO and analog inputs to minimize BOM and firmware complexity.
  • Industrial monitoring and portable instrumentation where small form factor, deterministic control and low power draw are required for continuous operation.
  • Appliance controls and energy?saving controllers that benefit from on?chip peripherals to replace multiple discrete parts and simplify supply chain sourcing.

MSP430G2230IDR Advantages vs Typical Alternatives

The device offers a balance of low power and system integration that often beats larger or less specialized microcontrollers. With integrated peripherals and low sleep currents (exact metrics available in the sheet), it reduces external BOM count and board area. Compared to general?purpose 8?bit controllers, the 16?bit architecture provides stronger computational headroom. Compared to higher?end MCUs, it delivers more efficient standby power profiles for battery critical applications.

MSP430G2230IDR Brand Info

The MSP430G2230IDR is part of the MSP430 family produced by Texas Instruments. Texas Instruments supplies development tools, reference designs and production support for this microcontroller family, focusing on low?power embedded control and broad industry adoption.

FAQ

What key datasheet sections are required?

I will extract the device summary, electrical characteristics, memory map, pinout, timing diagrams, power consumption tables, and package mechanical data. Each section yields exact numerical values for specification tables and design calculations.

Can you compare variants?

Yes. Once the sheet is provided I will compare this variant to other MSP430G2xx variants on memory size, clock limits, peripheral set, and package options to help sourcing decisions.

How will you ensure accuracy?

Accuracy comes from quoting only the numbers and limits printed in the supplied sheet. I will reference table and figure labels from the sheet so engineers can cross?check every value against the original document.

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产品中间询盘

Will you include PCB footprint details?

Yes. If the provided sheet contains the package outline and land pattern recommendations, I will include package dimensions and recommended solder?land geometry for board design and assembly verification.

What procurement information will you add?

I will add packaging codes, ordering part numbers, and typical supply?chain notes only if those specific items are present in the supplied sheet to avoid introducing unsupported procurement details.

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