MSP430FG4618IPZ 16-bit Microcontroller 100-Pin LQFP Package

MSP430FG4618IPZ Overview

I cannot produce a fully accurate, datasheet-based product description without access to the official product sheet for this device. To generate precise specifications, feature lists, numerical tables, and application guidance that rely only on documented data, I need the original sheet content or a link to it. Supplying the manufacturer datasheet or the exact sheet text enables a compliant, technically accurate description suitable for engineers and sourcing specialists. For reference resources, consider linking the official vendor documentation or a verified PDF from a component database such as IC Manufacturer.

MSP430FG4618IPZ Technical Specifications

MSP430FG4618IPZ Key Features

• Core processing ?? Refer to the datasheet for the exact 16-bit core capability and clock rate to determine throughput and code density advantages.
• Low-power modes ?? The sheet details sleep and standby currents that matter for battery-operated systems and long-term energy budgets.
• On-chip peripherals ?? Confirm integrated ADCs, timers, communication interfaces, and LCD controllers on the official sheet to assess integration and BOM reduction.
• Package options ?? The product sheet lists available package variants and thermal characteristics for PCB layout and thermal design considerations.

Typical Applications

• Battery-powered sensing and control nodes where documented low-power modes and documented supply ranges drive extended runtime and predictable behavior.
• Industrial control interfaces that require known timer, serial, and analog peripheral support as listed in the official product documentation.
• Human-machine interface designs that leverage on-chip display drivers and defined I/O counts from the sheet for compact panel controllers.
• Precision data-acquisition front ends where ADC resolution, sampling characteristics, and analog performance are taken directly from the datasheet.

MSP430FG4618IPZ Advantages vs Typical Alternatives

The product sheet provides the authoritative comparison points that matter: documented low-voltage operation, measured active and standby currents, memory sizes, and peripheral counts. Use those datasheet numbers to compare power-per-MHz, integrated peripheral count, and package density against other microcontrollers. With the official sheet you can quantify footprint, BOM reduction, and energy efficiency vs typical alternatives.

MSP430FG4618IPZ Brand Info

The MSP430 series is produced by Texas Instruments, a major supplier of analog and embedded processing solutions. The official product sheet identifies the device family positioning, supported development ecosystem, and recommended design resources from Texas Instruments for evaluation modules, compiler toolchains, and application notes tailored to this part number.

FAQ

What documentation is required?

To produce an accurate, datasheet-based product page I need the official product sheet or a verified link to the device datasheet. The sheet contains exact electrical specs, timing tables, memory sizes, and package mechanical drawings essential for engineers and purchasers.

Can you confirm electrical ratings?

Electrical ratings such as voltage ranges, current consumption, and maximum clock frequency must be quoted directly from the official datasheet to remain accurate and traceable for design and procurement decisions.

How will you format the technical table?

Once the datasheet is available I will extract numerical values for supply voltage, CPU speed, flash and RAM sizes, pin count, package type, operating temperature, and peripheral counts into a clear tabular format suitable for technical review and sourcing.

Do you include package mechanical drawings?

Yes. With the product sheet I will reference the package outline, land pattern recommendations, and thermal data so PCB designers can implement correct footprints and thermal vias based on manufacturer drawings.

Can you produce BOM-level guidance?

With the datasheet details and confirmed peripherals I can provide BOM-level guidance: clocking choices, decoupling recommendations, recommended external components, and notes for cost-effective sourcing aligned with documented device requirements.