MSP430F6779AIPZR 16-bit Microcontroller PZR Package

MSP430F6779AIPZR Overview

The MSP430F6779AIPZR is a low?power, 16?bit microcontroller designed for precision sensing and embedded control tasks. It combines a streamlined RISC core with a broad mix of on?chip analog and digital peripherals to reduce BOM count and board area. The device targets applications that need efficient power management, deterministic performance, and multiple serial and timer interfaces. Sourcing and design teams can reference the full datasheet for pinout and thermal details from the IC Manufacturer to validate package and supply constraints before integration.

MSP430F6779AIPZR Technical Specifications

MSP430F6779AIPZR Key Features

• 16?bit RISC core for efficient code density and predictable execution timing, which lowers instruction cycles versus wider architectures.
• Integrated 12?bit ADC enabling higher resolution sensing without external converters, improving accuracy and reducing component count.
• Multi?channel DMA that offloads data movement from the core, increasing throughput and lowering active power consumption for high data?rate tasks.
• Multiple 16?bit timers and serial interfaces for precise timing, motor control, and flexible connectivity to UART, SPI, and I2C peripherals.

Typical Applications

• Battery?operated sensing nodes that require ultra?low standby currents and high ADC resolution for accurate environmental monitoring over long periods.
• Industrial control modules that need deterministic timer behavior and multiple serial links for fieldbus or sensor aggregation tasks.
• Portable medical instruments where low power, precise analog measurement, and compact packaging are essential for wearable or handheld devices.
• Motor control front ends and power?management units that benefit from 16?bit timers, DMA for waveform generation, and integrated analog peripherals to simplify designs.

MSP430F6779AIPZR Advantages vs Typical Alternatives

The device emphasizes lower active and standby current compared with many 32?bit alternatives, which is advantageous for battery?centric designs. Its 16?bit architecture offers greater code density and simpler deterministic timing versus higher?word?width MCUs, reducing memory requirements. Integrated high?resolution ADC and multiple timers reduce the need for external components, which lowers BOM cost and board complexity. The LQFP package and broad operating voltage range provide easier migration into existing 3.3 V systems, and the DMA plus peripheral mix supports efficient data handling for real?time control.

MSP430F6779AIPZR Brand Info

The MSP430 family is produced by Texas Instruments and is recognized for low?power 16?bit microcontrollers used in sensing and control applications. This device continues that lineage with a focused balance of analog integration and power efficiency, making it suitable for industrial and portable markets where energy budget and integration density matter.

FAQ

What core architecture does it use?

The device uses a 16?bit RISC CPU core designed for compact code and efficient instruction execution. This architecture favors lower memory footprint and predictable timing for real?time embedded tasks.

What supply voltage range is supported?

It operates across a low?voltage range suitable for battery and system rails. This range supports common 1.8 V to 3.6 V designs and simplifies integration into standard embedded power domains.

How precise is the onboard ADC?

The integrated ADC provides 12?bit resolution for higher measurement fidelity than typical 10?bit converters, making it better for sensing applications that need improved signal resolution without external ADCs.

Is DMA available and why use it?

Yes, multi?channel DMA is present. DMA moves data between peripherals and memory autonomously, reducing CPU load and lowering active power use during continuous or burst transfers.

Which package is MSP430F6779AIPZR offered in?

The part is supplied in a 64?pin LQFP package (suffix PZR), which balances pin count and PCB real estate for medium?density I/O needs and thermal handling in industrial assemblies.