MSP430F5244IRGZT 16-Bit Microcontroller (IRGZT Package)

  • microcontroller control core enables efficient device management and simplified development
  • MSP430F5244IRGZT variant 5244 denotes specific feature set for predictable performance
  • Low-power operation and compact footprint reduce energy consumption and strain
  • Ideal for battery-powered sensing nodes, extends runtime while maintaining control
  • Manufacturing qualification, validation ensure robust operation and long-term field reliability
SKU: MSP430F5244IRGZT Category: Brand:
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产品上方询盘

MSP430F5244IRGZT Overview

The MSP430F5244IRGZT is a member of the MSP430 microcontroller family intended for low-power embedded designs. To prepare a specification-accurate product brief limited strictly to datasheet content, I need the referenced device sheet. Once the sheet is available I will extract precise numerical parameters, pinout and package details, peripheral sets, and electrical limits. For sourcing or redistribution links consult IC Manufacturer. Attach the official product sheet to enable a full, verified technical description and quantitative comparisons.

MSP430F5244IRGZT Technical Specifications

Parameter Value / Reference
Core architecture Refer to product sheet
CPU clock / max frequency Refer to product sheet
Flash memory size Refer to product sheet
SRAM size Refer to product sheet
Operating voltage range Refer to product sheet
Operating temperature range Refer to product sheet
Package type & pin count Refer to product sheet
Peripherals (ADC/DAC/Timers/UART/SPI/I2C) Refer to product sheet
Low-power modes Refer to product sheet
Maximum I/O count Refer to product sheet

MSP430F5244IRGZT Key Features

  • 16-bit MSP430 architecture with efficient code density, enabling compact firmware and lower memory needs.
  • Integrated peripheral set with standard serial interfaces, providing direct connectivity to sensors and external devices.
  • Designed for ultra-low-power operation to extend battery life in intermittent-activity systems and always-on nodes.
  • Package and pinout options that simplify board layout and streamline sourcing for production runs.

Typical Applications

  • Battery-powered sensor nodes that require long standby intervals and periodic data acquisition with minimal energy draw to maximize service life in the field.
  • Industrial control endpoints that need compact firmware, deterministic timer peripherals, and robust low-power behavior for remote instrumentation.
  • Portable medical monitoring instruments that demand reliable analog front-ends, data logging, and extended operation between charges or replacements.
  • Smart metering and energy monitoring interfaces where low idle current, precise timing, and integrated communications improve total system cost and reliability.

MSP430F5244IRGZT Advantages vs Typical Alternatives

Compared with many general-purpose 8-bit MCUs and higher-power 32-bit devices, this MSP430-class device typically offers lower active and standby power consumption and higher code efficiency per byte due to its 16-bit architecture. The family often integrates common analog and timing peripherals directly on-chip, which reduces board count and cost. For battery-operated or energy-sensitive designs, the overall system lifetime and complexity often compare favorably to alternatives when the device is selected to match application performance and peripheral needs.

MSP430F5244IRGZT Brand Info

The MSP430 series is produced by Texas Instruments, a global semiconductor manufacturer. TI supplies MSP430 devices for low-power embedded applications and supports them with documentation, development tools, and a wide supply chain footprint.

FAQ

What documentation is required?

To produce an accurate, spec-driven product description I need the device datasheet, errata, and relevant packaging drawing. These documents provide verified numerical limits, memory maps, and electrical characteristics.

Can you compare this MCU to others?

I can create a technical comparison, but it will be based strictly on datasheet values. Provide datasheets for the MSP430F5244IRGZT and the comparator parts so I can list exact differences in memory, power, and peripherals.

What package information is critical?

Package details needed include thermal characteristics, pin count, pitch, and mechanical drawings. These determine PCB footprint, assembly requirements, and thermal derating in production.

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产品中间询盘

Do you need firmware examples?

I can include sample peripheral initialization or an application block diagram once the datasheet and the intended development environment are provided. I avoid inventing register-level details without the official documentation.

How will sourcing specialists benefit?

Sourcing teams receive precise BOM-level attributes when the datasheet is available: exact package ordering codes, supply chain options, and compliance notes. Share the sheet to extract these procurement-critical details.

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