MSP430F423AIPM Overview
The MSP430F423AIPM is a member of the MSP430 microcontroller family focused on ultra?low power control and mixed?signal integration. To create a precise, engineering?grade product description that reflects only validated data from the official specification sheet, I need access to that sheet. Once supplied, I will extract and present the verified electrical ratings, memory sizes, peripheral counts, and package data exactly as published. For sourcing tasks and comparative selection, refer to IC Manufacturer as a starting point for distributor and cross?reference checks.
MSP430F423AIPM Technical Specifications
| Parameter | Value (from datasheet) |
|---|---|
| CPU architecture | Refer to the supplied specification sheet for the confirmed core description and clocking |
| Maximum clock frequency | Refer to the supplied specification sheet for the confirmed max MHz |
| Program memory type | Refer to the supplied specification sheet for confirmed Flash/FRAM size |
| On?chip RAM | Refer to the supplied specification sheet for confirmed RAM bytes |
| Operating voltage range | Refer to the supplied specification sheet for confirmed V range |
| Operating temperature range | Refer to the supplied specification sheet for confirmed temperature limits |
| Available I/O pins | Refer to the supplied specification sheet for confirmed pin count and functions |
| Package type | Refer to the supplied specification sheet for confirmed package code and mechanical drawing |
| Analog peripherals | Refer to the supplied specification sheet for ADC resolution, reference, and channel count |
| Communication interfaces | Refer to the supplied specification sheet for confirmed UART/SPI/I2C counts |
MSP430F423AIPM Key Features
- Ultra?low?power operation enables long battery life and energy?efficient control in embedded designs when compared to many 8?bit alternatives.
- Integrated mixed?signal peripherals such as ADCs and timers reduce BOM and board area versus separate analog and digital ICs.
- Flexible low?power modes allow duty?cycled processing with fast wakeup, improving efficiency and responsiveness in sensor and metering applications.
- Compact packaging and I/O permit higher system integration and smaller PCB footprints for industrial and portable products.
Typical Applications
- Battery?powered sensor nodes where minimal standby current and fast wake times extend lifetime and maintain responsive data capture and reporting.
- Industrial control modules requiring mixed?signal integration, deterministic timers, and multiple serial interfaces for fieldbus or sensor networks.
- Portable instrumentation that benefits from reduced component count and low average power for long operating periods on rechargeable cells.
- Energy?metrology front ends where accurate analog sampling, low drift, and low power enable smart metering and sub?metering designs.
MSP430F423AIPM Advantages vs Typical Alternatives
The MSP430F423AIPM combines a 16?bit control architecture with integrated analog and communications features to deliver higher efficiency per MHz compared with many 8?bit MCUs. Its ultra?low power modes and fast wake capability give clear system?level power advantages for battery and energy?sensitive designs. With integrated peripherals, you can reduce parts count and PCB area versus discrete solutions, improving reliability and lowering BOM cost while keeping deterministic control for industrial tasks.
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MSP430F423AIPM Brand Info
The MSP430 family is produced by Texas Instruments, a global semiconductor manufacturer. This device line emphasizes low power and mixed?signal integration for embedded control. The brand provides detailed datasheets, application notes, and development tools to support engineering evaluation, rapid prototyping, and volume deployment.
FAQ
What is the recommended source of the official data?
Use the official product datasheet and any associated application notes from the manufacturer as the authoritative source for electrical ratings, timing, and mechanical data. Distributor pages and package drawings supplement procurement details.
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How should I verify package and pinout?
Confirm the exact package code and pinout using the mechanical drawings in the official specification sheet and the package marking information to ensure correct footprint and board assembly orientation.
Can the device be used for battery?powered designs?
Yes, MSP430 devices are commonly targeted at battery?powered systems because of their low active and standby currents and multiple low?power modes for duty?cycled operation; confirm the actual current figures in the datasheet.
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What development tools are recommended?
Use the manufacturer’s development kits, programmers, and IDE support referenced in the product literature to validate firmware, perform profiling in different power modes, and test peripheral behavior before production.
How should I proceed to get a full specification sheet summary?
Attach the OEM specification sheet or provide a direct link to the product datasheet. With that, I will extract exact numerical specifications, update the technical table, and produce a finished, procurement?ready product description using only the validated data.
