MSP430F2616TPM Overview
The MSP430F2616TPM is a low-power 16?bit microcontroller from a proven MSP430 family. It combines a compact 16?bit CPU with integrated analog and digital peripherals to deliver efficient real?time control for battery?sensitive and embedded industrial solutions. Typical strengths include ultra?low standby modes, multiple serial interfaces, and on?chip A/D conversion for tighter system integration. Reference and purchasing information available from IC Manufacturer.
MSP430F2616TPM Technical Specifications
| Parameter | Value |
|---|---|
| CPU | 16?bit RISC core |
| Maximum clock | 16 MHz |
| Core operating voltage | 1.8?C3.6 V |
| Flash memory | 62 KB |
| RAM | 2 KB |
| ADC | 12?bit, multi?channel |
| Timers | Multiple 16?bit timers (Timer_A / Timer_B) |
| Serial interfaces | UART / SPI / I2C (USCI modules) |
| GPIO | Up to 64 I/O pins (package dependent) |
| Operating temperature | -40 ??C to +85 ??C |
| Package | 64?pin TQFP / TPM tape-and-reel variant |
MSP430F2616TPM Key Features
- 16?bit CPU for efficient integer math and compact code, reducing cycle counts versus 8?bit alternatives.
- Low voltage operation (1.8?C3.6 V) that enables direct interfacing to common battery chemistries and lower power rails.
- Integrated 12?bit ADC for higher resolution sensor measurements, cutting external component count and cost.
- Multiple serial interfaces including UART, SPI and I2C for flexible communications and subsystem integration.
- Multiple timers provide deterministic PWM and capture/compare functions useful for motor control and precise timing.
- Small package options with a TPM tape-and-reel configuration that supports automated assembly and high?volume production.
Typical Applications
- Battery?powered sensor nodes and data loggers where ultra?low standby currents extend runtime and reduce maintenance cycles.
- Industrial control modules that need deterministic timers, multiple serial links, and reliable analog inputs for process monitoring.
- Portable instruments and handheld meters requiring high?resolution A/D conversion and a compact, low?power microcontroller footprint.
- Embedded communication gateways that translate data between SPI/I2C sensors and serial links while minimizing energy use.
MSP430F2616TPM Advantages vs Typical Alternatives
The device offers a balance of low power and midrange performance compared with 8?bit MCUs and higher?end 32?bit parts. Its 16?bit core often yields smaller code size and faster integer math than 8?bit designs, while consuming significantly less active and standby current than many 32?bit alternatives. On?chip ADC, timers, and multiple serial modules reduce BOM and board complexity versus discrete solutions. The device is well suited for engineers seeking a cost?effective, energy?efficient controller with robust peripheral integration.
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MSP430F2616TPM Brand Info
The MSP430F2616TPM is part of the MSP430 microcontroller family from Texas Instruments. TI positions MSP430 devices for low?power embedded designs, offering comprehensive development tools, documentation, and long?term product support that aid rapid prototyping and production scaling.
FAQ
What is the core architecture?
The device uses a 16?bit RISC core optimized for low power and efficient code density, delivering faster integer operations and smaller firmware size than many 8?bit controllers.
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What supply voltage is supported?
It operates across a low?voltage rail typically from 1.8 V to 3.6 V, allowing direct connection to common battery supplies and low?voltage digital domains.
Does it include analog converters?
Yes. The MCU integrates a multi?channel 12?bit ADC, enabling higher?resolution sensor inputs and reducing the need for external ADC components in measurement applications.
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Which serial interfaces are available?
On?chip serial modules include UART, SPI, and I2C (USCI architecture), enabling flexible connection to sensors, radios, and host processors without extra interface chips.
How is the part supplied for production?
The TPM suffix denotes a tape?and?reel packaging option suitable for automated surface?mount assembly, and standard surface mount packages such as TQFP are commonly used for prototypes and low?volume builds.



