MSP430F2111IPW 16-bit Low-Power Microcontroller ?C 20-Pin TSSOP Package

MSP430F2111IPW Overview

The MSP430F2111IPW is a low-power, 16-bit microcontroller designed for cost-sensitive embedded designs that need efficient control, timing and analog conversion. It combines a compact package and a small memory footprint with standard MSP430 low-power modes and integrated peripherals. Use this device when you need predictable performance, simple integration and long battery life in industrial or portable sensor applications. Learn more through IC Manufacturer.

MSP430F2111IPW Technical Specifications

MSP430F2111IPW Key Features

• 16-bit RISC core ?? delivers compact code and efficient control for embedded tasks, reducing instruction overhead and improving deterministic response.
• Low-voltage operation ?? runs from 1.8 V to 3.6 V, which supports single-cell battery systems and reduces power-conversion complexity.
• Hardware 10-bit ADC ?? provides precise analog-to-digital conversion for sensors and monitoring with fewer external components.
• 16-bit Timer_A ?? enables accurate PWM generation, timing capture and pulse measurement for motor control and power management.
• Small memory footprint ?? 2 KB flash and 128 B RAM make the device economical for simple control loops and firmware with tight code size.
• Multiple power-saving modes ?? extend battery life and lower system energy use by combining active and standby states.
• Compact 20-pin TSSOP package ?? reduces PCB area and supports cost-effective board layouts in constrained mechanical envelopes.

Typical Applications

• Battery-powered sensor nodes that require low standby current and periodic analog sampling with a simple control loop and tight power budget.
• Portable medical and health-monitoring devices where compact size, low voltage operation and reliable ADC performance are key for continuous measurement.
• Industrial sensor interfaces and distributed I/O modules needing simple timing, event capture and modest firmware stored in small flash memory.
• Consumer control panels and simple user-interface boards that benefit from low cost, timer-based dimming or scanning and mixed-signal inputs.

MSP430F2111IPW Advantages vs Typical Alternatives

The device offers a strong balance of energy efficiency and control features in a smaller memory and smaller package class. Compared with general-purpose 8-bit MCUs, the 16-bit core provides more efficient arithmetic and tighter code density for many algorithms. Against larger MSP430 variants, this part uses less board area and lower cost while still providing a 10-bit ADC and 16-bit timer for most sensing and timing needs. The low-voltage range and multiple power modes make it preferable where battery lifetime and simple integration drive design choices.

MSP430F2111IPW Brand Info

The MSP430 family is produced by Texas Instruments, a long-established semiconductor manufacturer. This MCU line emphasizes ultra-low power consumption, a consistent development ecosystem and broad application support. The MSP430F2111IPW fits TI’s strategy of offering compact, low-cost microcontrollers for embedded systems that demand long battery life and reliable analog peripherals.

FAQ

What core does this MCU use?

It uses a 16-bit RISC CPU core from the MSP430 family. That core focuses on low-power operation and efficient code density for embedded control tasks.

What supply voltage is required?

The device operates across a low-voltage range suitable for single-cell battery systems. Designers can run the part without external high-voltage regulators in many portable applications.

How much nonvolatile memory is available?

Flash memory is provided on-chip to store firmware. The small flash size supports compact control code and helps reduce bill of materials for cost-sensitive projects.

Which analog features are included?

On-chip 10-bit analog-to-digital conversion is available for direct sensor interfacing. This reduces the need for external ADC components in many measurement tasks.

Which package suits tight PCB designs?

The 20-pin TSSOP (PW) package keeps the PCB footprint small. It allows the MCU to fit into compact enclosures and supports automated assembly with standard thermal profiles.