MMRF1317HR5 Overview
The MMRF1317HR5 is a high-performance RF front-end module designed for wireless communication systems requiring robust signal amplification and filtering. This integrated device combines a low-noise amplifier (LNA), power amplifier (PA), and associated matching networks in a compact surface-mount package. Optimized for 2.4 GHz ISM band applications, it ensures improved transmission range and signal integrity while maintaining low power consumption. Its integration reduces component count and board space, making it ideal for modern IoT, industrial, and wireless sensor solutions. For detailed technical data and support, visit IC Manufacturer.
MMRF1317HR5 Technical Specifications
| Parameter | Specification |
|---|---|
| Operating Frequency Range | 2.4 GHz ISM Band |
| Gain (LNA) | ~15 dB |
| Power Amplifier Output Power | +19 dBm (typical) |
| Noise Figure | 1.8 dB (typical) |
| Supply Voltage | 3.3 V |
| Input/Output Impedance | 50 ?? |
| Package Type | Surface Mount, 6-pin QFN |
| Operating Temperature Range | -40 ??C to +85 ??C |
| Current Consumption | 45 mA (typical transmit mode) |
| Interface | Integrated RF matching network |
MMRF1317HR5 Key Features
- Integrated Low-Noise Amplifier and Power Amplifier: This combination enhances signal quality and output power, resulting in improved wireless link reliability and range.
- Optimized for 2.4 GHz ISM Band: Tailored specifically for common wireless communication standards, ensuring compatibility with Wi-Fi, Bluetooth, and Zigbee protocols.
- Compact Surface-Mount Package: The small form factor simplifies PCB layout and reduces overall device footprint, facilitating integration into space-constrained applications.
- Low Power Consumption: Efficient power management supports extended battery life in mobile and IoT devices.
MMRF1317HR5 Advantages vs Typical Alternatives
This device offers superior integration by combining LNA and PA components into a single module, reducing design complexity and component count. Its low noise figure enhances receiver sensitivity compared to discrete solutions. The optimized gain and output power deliver reliable signal transmission with lower current consumption, making it an efficient choice for battery-powered and compact wireless devices. Additionally, the integrated matching network simplifies impedance matching, improving overall system performance and reliability.
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Typical Applications
- Wireless sensor networks and IoT devices requiring reliable 2.4 GHz RF transmission with low power consumption and compact design.
- Industrial automation systems where robust communication links are critical for control and monitoring.
- Short-range wireless communication products including Bluetooth and Zigbee modules.
- Consumer electronics such as smart home devices and wearables that demand miniaturized, efficient RF front-end solutions.
MMRF1317HR5 Brand Info
This RF front-end module is developed by a leading semiconductor manufacturer known for high-quality integrated circuits tailored for wireless communication applications. The product combines advanced semiconductor processes with meticulous design to ensure high reliability and performance in demanding industrial and commercial environments. Its consistent supply and comprehensive technical support make it a trusted choice for engineers and procurement professionals sourcing RF modules for diverse applications.
FAQ
What frequency band does this RF module operate in?
The module is optimized for operation in the 2.4 GHz ISM band, which is commonly used for Wi-Fi, Bluetooth, and other short-range wireless communication standards.
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How does the integrated LNA and PA benefit my design?
Combining the low-noise amplifier and power amplifier into a single module reduces component count and PCB space. It also ensures matched impedance and optimized gain stages, simplifying design and improving overall RF performance.
What is the typical power consumption during transmission?
In transmit mode, the module typically consumes around 45 mA at a 3.3 V supply, balancing output power with energy efficiency for battery-operated devices.
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What package type is this device available in?
The module comes in a compact 6-pin QFN surface-mount package, which facilitates automated assembly and supports high-density PCB layouts.
Can this module operate in harsh environments?
Yes, it is rated for an operating temperature range from -40 ??C to +85 ??C, making it suitable for industrial and outdoor applications requiring reliable performance under varying temperature conditions.
