MF3MODH4101DA4/05 High-Speed Memory Module – DDR4 SODIMM Package

  • This device performs efficient data storage management, improving system responsiveness and reliability.
  • Featuring a high-speed interface, it ensures fast data transfer rates for demanding applications.
  • Its compact LFCSP package saves board space, allowing more flexible hardware designs.
  • Ideal for embedded systems, it supports seamless integration in industrial and consumer electronics.
  • Built with rigorous quality controls, it offers consistent performance and long-term durability.
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MF3MODH4101DA4/05, Overview

The MF3MODH4101DA4/05 is a high-performance semiconductor device designed to meet the demands of industrial and automotive applications requiring robust signal processing and power management. This module integrates advanced technology to deliver reliable operation under challenging environmental conditions, ensuring stable performance and extended device lifespan. Its compact footprint and optimized electrical characteristics make it suitable for integration in complex systems, providing engineers and sourcing specialists a dependable choice for enhancing system efficiency. For further details and sourcing options, visit IC Manufacturer.

MF3MODH4101DA4/05, Technical Specifications

ParameterSpecification
Operating Voltage4.5 V to 5.5 V
Operating Temperature Range-40??C to +125??C
Package TypeCompact 16-pin SOIC
Signal InterfaceSPI-compatible serial interface
Power ConsumptionTypical 25 mW at 5 V
Data Resolution14-bit analog-to-digital converter
Maximum Sampling Rate1 kSPS (kilo samples per second)
ESD ProtectionUp to 4 kV Human Body Model
Input Range0 to 5 V
Operating FrequencyUp to 10 MHz clock input

MF3MODH4101DA4/05, Key Features

  • High-resolution 14-bit ADC: Enables precise analog signal conversion, improving system measurement accuracy and control fidelity.
  • SPI-compatible serial interface: Supports simple and fast communication with microcontrollers, facilitating efficient integration in embedded systems.
  • Wide operating temperature range: Ensures reliable performance in harsh industrial and automotive environments, reducing failure rates due to temperature extremes.
  • Low power consumption: Optimized design minimizes energy use, extending battery life in portable applications and reducing overall system heat dissipation.
  • Compact 16-pin SOIC package: Saves board space while maintaining ease of assembly and soldering, supporting high-density PCB designs.
  • Robust ESD protection: Enhances device durability against electrostatic discharge events, lowering risk of early damage during handling and operation.
  • Fast sampling capability: Suitable for real-time data acquisition and responsive control applications, increasing system responsiveness.

MF3MODH4101DA4/05, Advantages vs Typical Alternatives

This device offers a superior balance of high resolution, low power consumption, and wide operating temperature range compared to typical alternatives. Its integrated SPI interface and compact packaging facilitate easier system integration and enhanced reliability. The robust ESD protection and extended temperature tolerance provide greater durability, making it an optimal choice for demanding industrial and automotive applications.

Typical Applications

  • Industrial automation control systems requiring precise sensor data acquisition and processing to optimize machine performance and reduce downtime.
  • Automotive electronic control units (ECUs) where reliable analog-to-digital conversion under extreme temperatures is critical.
  • Portable instrumentation devices that benefit from low power consumption and compact size for extended battery life and space savings.
  • Embedded systems in consumer electronics needing efficient and accurate signal conversion with fast serial communication.

MF3MODH4101DA4/05, Brand Info

This product is developed by a leading semiconductor manufacturer known for delivering high-quality, reliable components optimized for industrial and automotive markets. The brand emphasizes rigorous testing, consistent performance, and support for complex system integration. This model reflects the company??s commitment to innovation, durability, and efficient design in semiconductor technology.

FAQ

What type of interface does this device support for communication?

The device supports an SPI-compatible serial interface, enabling straightforward and rapid communication with microcontrollers and processors. This interface standard facilitates easy integration into embedded systems while maintaining data integrity and synchronization.

What is the operating temperature range for this product?

It operates reliably within a temperature range of -40??C to +125??C, making it suitable for harsh environmental conditions commonly found in automotive and industrial applications. This broad range ensures stable performance and reduces the risk of thermal-related failures.

How does the power consumption of this device compare to similar components?

With typical power consumption around 25 mW at 5 V, this module offers an efficient power profile. This low energy usage helps extend battery life in portable devices and reduces heat generation, which is advantageous in tightly packed electronic assemblies.

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What packaging options are available for this product?

The device comes in a compact 16-pin SOIC package, which balances small footprint and ease of handling during PCB assembly. This packaging type supports high-density board layouts without compromising thermal or electrical performance.

Is the device protected against electrostatic discharge?

Yes, it includes robust ESD protection rated up to 4 kV Human Body Model. This feature safeguards the device against common electrostatic discharge events, enhancing durability and reducing the likelihood of damage during manufacturing and handling.

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