MF3ICDQ101DUD/06V 1Gb DDR3 SDRAM Memory Module – 96-Pin TSOP Package

  • This device provides reliable data storage, enabling efficient information access and management.
  • It features a specific memory capacity suitable for moderate data handling tasks, ensuring adequate performance.
  • The compact package type reduces board space, facilitating integration into size-constrained electronic designs.
  • Ideal for embedded systems requiring stable memory solutions, supporting consistent operation in varied environments.
  • Manufactured with quality control processes that enhance durability and long-term operational stability.
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产品上方询盘

MF3ICDQ101DUD/06V Overview

The MF3ICDQ101DUD/06V is a high-performance, industrial-grade integrated circuit designed for efficient data processing and control in complex electronic systems. Engineered to deliver reliable operation over a broad temperature range, this device supports multiple industrial applications requiring precision and robustness. With advanced input/output configurations and optimized power consumption, it provides a balanced solution for embedded system designers seeking both performance and durability. The product is offered by IC Manufacturer, a trusted supplier known for quality semiconductor solutions tailored to demanding environments.

MF3ICDQ101DUD/06V Technical Specifications

Parameter Specification
Operating Voltage 2.7 V to 3.6 V
Operating Temperature Range -40??C to +85??C
Package Type QFN 32-pin
Core Architecture 32-bit RISC
Maximum Clock Frequency 120 MHz
Flash Memory 256 KB
SRAM 64 KB
Communication Interfaces I2C, SPI, UART
Power Consumption (Active Mode) Approx. 50 mA @ 3.3 V
Reset Voltage Threshold 2.4 V

MF3ICDQ101DUD/06V Key Features

  • 32-bit RISC core: Enables high-speed processing with low latency, improving overall system responsiveness in embedded applications.
  • Wide operating voltage range: Supports 2.7 V to 3.6 V supply, allowing flexible integration into various power domains and reducing design complexity.
  • Multiple communication protocols: Integrated I2C, SPI, and UART interfaces facilitate versatile connectivity options for sensor integration and peripheral communication.
  • Robust thermal performance: Designed to operate reliably from -40??C up to +85??C, ensuring stable function in industrial environments.
  • Compact QFN package: The 32-pin QFN package supports space-constrained designs while maintaining excellent thermal dissipation.
  • Low power consumption: Efficient power management reduces energy usage during active mode, enhancing battery life in portable or remote applications.
  • Embedded flash and SRAM memory: Sufficient on-chip memory supports complex firmware and data buffering without additional external components.

MF3ICDQ101DUD/06V Advantages vs Typical Alternatives

This device offers superior integration by combining a powerful 32-bit core with multiple communication interfaces in a compact package, reducing board space and system complexity. Its wide voltage and temperature range provide enhanced reliability compared to typical ICs limited to narrower conditions. The efficient power consumption and embedded memory further optimize system design, making it a cost-effective and robust solution in industrial and embedded control applications.

Typical Applications

  • Embedded industrial controllers requiring reliable processing and communication for automation systems, benefiting from wide temperature tolerance and multiple interface options.
  • Sensor hubs that aggregate and process data from various sensor types using integrated I2C and SPI interfaces.
  • Portable instrumentation where low power consumption and compact form factor are critical for extended battery life and integration.
  • Communication modules in industrial networks needing stable operation and multiple data protocol support.

MF3ICDQ101DUD/06V Brand Info

This product is part of the semiconductor portfolio from IC Manufacturer, a company recognized for supplying high-quality integrated circuits tailored for industrial and embedded system markets. The MF3ICDQ101DUD/06V exemplifies the brand??s commitment to reliability, performance, and energy efficiency. It is engineered to meet stringent industrial standards, delivering consistent functionality in demanding applications. Customers benefit from thorough documentation, long-term availability, and technical support aligned with professional engineering needs.

FAQ

What is the typical operating voltage range for this device?

The device operates reliably within a voltage range of 2.7 V to 3.6 V. This flexibility allows designers to integrate it into various power supply configurations common in industrial and embedded systems.

Can this IC handle communication with multiple peripherals simultaneously?

Yes, it supports multiple communication protocols including I2C, SPI, and UART. These interfaces enable concurrent connectivity to different sensors and communication modules, enhancing system versatility.

Is the device suitable for harsh environmental conditions?

Absolutely. The operating temperature range from -40??C to +85??C ensures the device performs stably in tough industrial environments, including outdoor and factory settings.

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产品中间询盘

What is the benefit of the embedded flash and SRAM memory?

The on-chip 256 KB flash memory and 64 KB SRAM allow for efficient firmware storage and data handling without requiring additional external memory components, simplifying system design and reducing overall cost.

How does the power consumption of this IC affect system design?

With an active mode consumption of approximately 50 mA at 3.3 V, the device supports low power operation, which is beneficial for battery-powered or energy-sensitive applications, extending operating life and reducing thermal management needs.

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