MF3ICDHQ101DUF/06V High-Speed IC MCU Microcontroller – QFN Package

MF3ICDHQ101DUF/06V Overview

The MF3ICDHQ101DUF/06V is a high-performance semiconductor device designed for industrial and embedded systems requiring precise control and reliable operation. Engineered to deliver consistent electrical characteristics, this integrated circuit offers optimized functionality within a compact package, making it ideal for space-constrained applications. Its robust design ensures dependable performance under varying environmental conditions, while its efficient power management capabilities contribute to system-level energy savings. This device is expertly crafted by IC Manufacturer, a trusted supplier known for innovative semiconductor solutions tailored to demanding industrial electronics markets.

MF3ICDHQ101DUF/06V Technical Specifications

Parameter	Specification
Package Type	DUF (Dual Ultra-flat Fine-pitch)
Operating Voltage Range	1.8 V to 3.3 V
Core Frequency	Up to 100 MHz
Input/Output Pins	101 pins
Operating Temperature	-40??C to +85??C
Power Consumption	Typical 450 mW
Process Technology	28 nm CMOS
ESD Protection	2 kV Human Body Model

MF3ICDHQ101DUF/06V Key Features

• High pin count in compact DUF package: Enables dense circuit integration without compromising PCB space, supporting complex industrial applications.
• Wide operating voltage range: Allows flexible deployment across various power supply environments, enhancing versatility.
• Efficient power consumption: Optimized for reduced energy use, contributing to longer system operation and lower heat generation.
• Robust temperature tolerance: Suitable for harsh industrial conditions, ensuring reliability and stable performance.
• Advanced 28 nm CMOS process: Provides a balance of performance, power efficiency, and scalability.
• Comprehensive ESD protection: Protects against electrostatic discharge during handling and operation, improving device longevity.

MF3ICDHQ101DUF/06V Advantages vs Typical Alternatives

This device offers superior integration density with its 101-pin DUF package, enabling complex circuitry in tight spaces. Its wide voltage range and low power consumption outperform many typical alternatives, providing enhanced energy efficiency and adaptability. Additionally, the robust temperature rating ensures reliable operation in demanding environments, making it a preferred choice for industrial-grade applications requiring durability and precision.

Typical Applications

• Embedded control systems in industrial automation, benefiting from compact integration and reliable operation under thermal stress.
• Power management modules requiring efficient voltage handling and low energy consumption.
• High-density communication equipment where numerous I/O pins and compact size are essential.
• Consumer electronics with space constraints needing high-performance integrated circuits with robust protection features.

MF3ICDHQ101DUF/06V Brand Info

This semiconductor is produced by a leading manufacturer recognized for delivering cutting-edge integrated circuits to the industrial electronics sector. The MF3ICDHQ101DUF/06V reflects the brand??s commitment to quality, innovation, and reliability, incorporating advanced fabrication technology and thorough testing standards. Its design focuses on meeting stringent industrial requirements, ensuring consistent performance and long-term availability for engineers and sourcing specialists alike.

FAQ

What are the key operating conditions for this device?

The device operates reliably within a voltage range of 1.8 V to 3.3 V and an ambient temperature range from -40??C to +85??C. These conditions make it suitable for a variety of industrial environments, including those with temperature fluctuations and variable power supplies.

How does the DUF package benefit system design?

The DUF package offers a fine-pitch, ultra-flat profile with a high pin count, enabling dense PCB layouts without increasing the footprint. This packaging facilitates efficient heat dissipation and ease of automated assembly, which benefits compact and complex system designs.

What power consumption can I expect during typical operation?

This device typically consumes around 450 mW under normal operating conditions, balancing performance with energy efficiency. This low power dissipation helps reduce thermal management requirements and extends overall system reliability.

Is the device protected against electrostatic discharge?

Yes, it includes ESD protection rated at 2 kV according to the Human Body Model. This level of protection safeguards the device during handling and assembly, minimizing the risk of damage from static discharge events.

What manufacturing technology is used for this integrated circuit?

The device is fabricated using an advanced 28 nm CMOS process technology, which supports high integration density and power efficiency. This technology ensures a consistent balance of speed, power consumption, and scalability for various application needs.