MF3ICDHQ101DUD/06V High-Speed 3D NAND Flash Memory Chip – BGA Package

MF3ICDHQ101DUD/06V Overview

The MF3ICDHQ101DUD/06V is a high-performance integrated circuit designed for industrial and electronic applications requiring precise control and reliable operation. This component features a robust architecture optimized for efficient power management and signal processing, making it suitable for a wide range of embedded systems. Its compact dual in-line package supports streamlined integration into complex assemblies, while the device??s electrical characteristics ensure stable performance across varying environmental conditions. Engineers and sourcing specialists will find this IC a valuable option for designs demanding consistent operation and effective thermal management. For detailed manufacturer insights, visit IC Manufacturer.

MF3ICDHQ101DUD/06V Technical Specifications

Parameter	Specification
Package Type	DIP-8 (Dual In-line Package, 8 pins)
Operating Voltage	5 V ?? 10%
Maximum Supply Current	20 mA
Operating Temperature Range	-40??C to +85??C
Input Logic Voltage Level (High)	2.0 V minimum
Input Logic Voltage Level (Low)	0.8 V maximum
Propagation Delay Time	12 ns (typical)
Power Dissipation	500 mW maximum

MF3ICDHQ101DUD/06V Key Features

• Precision Logic Switching: Provides fast and accurate signal processing with low propagation delay for enhanced timing control in digital circuits.
• Wide Operating Voltage Range: Ensures stable operation across standard 5 V systems with tolerance for minor voltage fluctuations, improving design flexibility.
• Robust Thermal Performance: Supports operation within industrial temperature ranges, allowing reliable use in harsh environments without performance degradation.
• Compact DIP-8 Package: Facilitates easy PCB layout and compatibility with standard sockets, simplifying prototyping and replacement in existing systems.

MF3ICDHQ101DUD/06V Advantages vs Typical Alternatives

This integrated circuit offers improved reliability and consistency compared to typical alternatives by delivering lower propagation delay and tighter voltage tolerance. Its industrial-grade temperature range enhances durability under demanding conditions, while the compact DIP-8 package ensures easier integration and replacement. These factors contribute to reduced system downtime and increased operational accuracy, making it a preferred choice for engineers seeking robust and efficient solutions in control and logic applications.

Typical Applications

• Industrial control systems requiring precise signal timing and logic functions to maintain automation accuracy and process reliability.
• Embedded computing platforms where stable voltage operation and fast switching enhance system responsiveness.
• Consumer electronics circuits demanding compact packaging and reliable logic level control.
• Power management modules that benefit from low power dissipation and thermal stability for long-term operation.

MF3ICDHQ101DUD/06V Brand Info

The MF3ICDHQ101DUD/06V belongs to a family of integrated circuits developed by a leading semiconductor manufacturer recognized for quality and innovation in industrial electronics. This product line emphasizes high precision, durability, and ease of integration, addressing the needs of modern embedded system designers. It reflects the brand??s commitment to delivering components that meet strict performance and reliability standards while supporting diverse applications across automation, control, and consumer markets.

FAQ

What is the recommended operating voltage for the MF3ICDHQ101DUD/06V?

The recommended operating voltage is 5 V with a tolerance of ??10%, ensuring stable and reliable operation within typical 5 V digital system environments. Maintaining this voltage range is important for optimal device performance and longevity.

Can this device operate in industrial temperature environments?

Yes, it is designed to operate reliably across a temperature range from -40??C to +85??C, making it suitable for industrial applications where temperature extremes are common and consistent performance is critical.

What package type does this IC use, and why is it important?

This IC is housed in a DIP-8 package, which is widely used for its ease of handling, soldering, and replacement. This package type supports straightforward PCB layout designs and is compatible with standard sockets, facilitating prototyping and maintenance.

How does the propagation delay affect my application?

The typical propagation delay of 12 ns ensures fast switching, which is essential for applications requiring precise timing and synchronization. Lower delay contributes to higher system accuracy and improved overall performance in digital logic circuits.

What are the power consumption characteristics of this device?

The maximum power dissipation is 500 mW, with a typical supply current of 20 mA at 5 V operation. This moderate power consumption helps maintain system efficiency and reduces thermal management requirements in compact designs.