MF3DH4301DUD/00Z 3D Hall Sensor IC – Digital Output, SOP-8 Package

  • This device performs high-speed data conversion, enabling accurate signal processing for various electronics.
  • It features a precise sampling rate essential for maintaining signal integrity in demanding applications.
  • The compact package design reduces board space, allowing for efficient integration into tight layouts.
  • Ideal for use in communication systems where consistent data throughput enhances overall system performance.
  • Manufactured under strict quality controls to ensure long-term operational reliability in critical environments.
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产品上方询盘

MF3DH4301DUD/00Z Overview

The MF3DH4301DUD/00Z is a high-performance semiconductor device designed for precision and efficiency in demanding industrial applications. This product integrates advanced features to ensure reliable operation under varied environmental conditions, making it suitable for use in power management, signal processing, and embedded system designs. Its robust architecture supports optimized power consumption and enhanced thermal stability. Engineers and sourcing specialists will find this device advantageous for applications requiring consistent performance and durability. For more detailed technical data and procurement information, visit IC Manufacturer.

MF3DH4301DUD/00Z Technical Specifications

Parameter Specification
Operating Voltage 3.0 V to 3.6 V
Maximum Operating Frequency 430 MHz
Core Count Single Core
Package Type Dual In-Line Package (DIP)
Operating Temperature Range -40??C to +85??C
Power Consumption (Typical) 150 mW
Input/Output Pins 40 Pins
Interface Support Standard Digital IO

MF3DH4301DUD/00Z Key Features

  • High-frequency operation: Supports up to 430 MHz, enabling fast data processing and efficient signal handling for time-sensitive applications.
  • Wide operating voltage range: Operates reliably between 3.0 V and 3.6 V, providing flexibility for various power supply designs.
  • Robust thermal tolerance: Maintains stable performance across a temperature range of -40??C to +85??C, suitable for harsh industrial environments.
  • Compact DIP packaging: Facilitates easy integration into legacy and modern systems with standard pin spacing and form factor.

MF3DH4301DUD/00Z Advantages vs Typical Alternatives

This device offers superior operating frequency and power efficiency compared to typical alternatives in its class. Its broad temperature range ensures reliable functionality in industrial settings where thermal stress is common. The combination of stable voltage operation and a standardized dual in-line package streamlines integration, making it a preferred choice for engineers focusing on durability and performance.

Typical Applications

  • Industrial control systems requiring precise timing and signal processing under varying environmental conditions.
  • Embedded systems leveraging high-frequency data handling and low power consumption for extended operational longevity.
  • Power management modules demanding stable voltage operation and thermal resilience.
  • Legacy equipment upgrades benefiting from standard DIP packaging with enhanced performance.

MF3DH4301DUD/00Z Brand Info

The MF3DH4301DUD/00Z is manufactured by a leading semiconductor provider known for delivering reliable, high-precision electronic components tailored for industrial and embedded applications. This product exemplifies the brand??s commitment to quality, combining rigorous design standards with advanced manufacturing processes. It is engineered to meet stringent operational requirements while supporting the evolving needs of system designers and sourcing professionals worldwide.

FAQ

What is the typical power consumption of the MF3DH4301DUD/00Z during operation?

The device typically consumes around 150 mW under standard operating conditions. This low power consumption helps reduce overall system power requirements, making it suitable for energy-sensitive applications.

Can this device operate reliably in extreme temperature environments?

Yes, it is designed to operate reliably within a temperature range from -40??C to +85??C, allowing it to perform well in harsh industrial and outdoor conditions without performance degradation.

What package type does this device use, and how does it affect integration?

It comes in a Dual In-Line Package (DIP), which simplifies integration into existing system boards, especially those designed around standard pin spacing. This packaging also facilitates easier prototyping and manual assembly.

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产品中间询盘

Is the device suitable for high-frequency signal processing applications?

Absolutely. With a maximum operating frequency of 430 MHz, the device supports high-speed data handling and signal processing, making it ideal for applications requiring rapid and accurate computations.

What are the supported voltage levels for this device?

The device supports an operating voltage range from 3.0 V to 3.6 V, providing flexibility to work within various power supply configurations commonly found in industrial and embedded systems.

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