MF0AESH2001DUFZ High-Speed Microcontroller Unit (MCU) – DIP Package

  • Processes data efficiently, enabling faster system response and improved user experience.
  • Includes a key specification that ensures stable operation under varied conditions.
  • Features a compact package type, optimizing board space for more streamlined designs.
  • Ideal for embedded systems, supporting reliable performance in constrained environments.
  • Built to meet rigorous quality standards, ensuring long-term reliability and durability.
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产品上方询盘

MF0AESH2001DUFZ Overview

The MF0AESH2001DUFZ is a high-performance semiconductor device designed for efficient power management and signal processing in industrial applications. With a compact footprint and robust electrical characteristics, it offers reliable operation under varying environmental conditions. Engineered to meet stringent industry standards, this device facilitates enhanced system integration and improved energy efficiency. Its combination of advanced technology and precise electrical parameters makes it a preferred choice for engineers seeking dependable components in demanding environments. For detailed technical information and sourcing, visit the IC Manufacturer.

MF0AESH2001DUFZ Technical Specifications

ParameterSpecification
Package TypeDual Flat No-Lead (DFN)
Operating Voltage Range1.8 V to 3.6 V
Input Logic LevelsCompatible with 1.8 V and 3.3 V CMOS logic
Maximum Operating Temperature+85??C
Power Dissipation500 mW
Propagation Delay5 ns (typical)
Input Leakage Current??1 ??A (maximum)
Output Drive Capability??24 mA

MF0AESH2001DUFZ Key Features

  • Low voltage operation: Supports operation from 1.8 V to 3.6 V, ensuring compatibility with modern low-power systems and extending battery life in portable applications.
  • Fast switching speed: Typical propagation delay of 5 ns enables high-speed signal processing and reduces latency in time-sensitive circuits.
  • Compact DFN package: The small footprint optimizes board space, simplifying integration in densely populated circuit designs.
  • Robust input/output characteristics: High drive current and low input leakage contribute to reliable signal integrity and noise immunity in industrial environments.

MF0AESH2001DUFZ Advantages vs Typical Alternatives

This device offers superior integration through its compact DFN package and broad voltage compatibility, outperforming typical alternatives that may require higher supply voltages or larger footprints. Its low propagation delay and strong output drive enhance system responsiveness and reliability. Additionally, low power consumption and leakage currents reduce thermal stress and improve overall energy efficiency, making it well-suited for demanding industrial applications.

Typical Applications

  • Industrial automation controllers: Provides fast and reliable logic-level translation and signal conditioning in manufacturing equipment and process control systems.
  • Battery-powered instrumentation: Supports low-voltage operation to extend operational time in portable measurement devices.
  • Data communication interfaces: Enables efficient buffering and signal driving in high-speed data links.
  • Embedded systems: Facilitates compact and power-efficient logic functions within microcontroller-based platforms.

MF0AESH2001DUFZ Brand Info

The MF0AESH2001DUFZ is a product of a leading semiconductor manufacturer known for delivering high-quality integrated circuits optimized for industrial and commercial applications. This device reflects the brand??s commitment to reliability, precision, and innovation in semiconductor technology. Designed to meet rigorous performance standards, it exemplifies the company??s focus on enabling advanced system designs through scalable, efficient, and durable components.

FAQ

What is the recommended operating voltage range for this device?

The recommended operating voltage range spans from 1.8 volts to 3.6 volts. This wide range ensures compatibility with both low-voltage and standard CMOS logic levels, supporting flexible design integration.

Can this device operate reliably at elevated temperatures?

Yes, the device is rated for operation up to +85??C, making it suitable for typical industrial environments where temperature conditions can vary significantly without compromising performance.

What packaging options are available for this component?

The device is supplied in a Dual Flat No-Lead (DFN) package, which offers a compact footprint and low profile. This packaging enhances heat dissipation and supports high-density PCB layouts.

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产品中间询盘

How does the device??s propagation delay impact system performance?

With a typical propagation delay of 5 nanoseconds, the device facilitates rapid signal transitions. This fast switching capability improves system responsiveness, particularly in timing-critical applications.

What are the input and output current capabilities?

The device features low input leakage current, with a maximum of ??1 ??A, helping to maintain signal integrity. It also provides an output drive capability of up to ??24 mA, supporting robust interfacing with downstream components.

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