MAX3373EEBL+T Level Shifter IC – 16-Pin TSSOP Package for Voltage Translation

  • MAX3373EEBL+T provides level shifting for digital signals between different voltage systems.
  • Supports multiple channels, allowing for versatile signal management in various applications.
  • Compact footprint design saves valuable board space in your electronic projects.
  • Ideal for interfacing microcontrollers with sensors operating at different voltage levels.
  • Built with reliable components to ensure consistent performance and long-lasting operation.
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MAX3373EEBL+T Overview

The MAX3373EEBL+T is a robust, low-power device designed for versatile applications in industrial technology. Featuring advanced features for signal integrity and reliability, this component enhances system performance in various electronic designs. Its compact packaging allows for seamless integration, making it a preferred choice for engineers seeking efficiency and quality. For additional insights, visit IC Manufacturer.

MAX3373EEBL+T Key Features

  • Low Power Consumption: Reduces overall energy usage, enabling longer battery life in portable applications.
  • High Signal Integrity: Ensures reliable communication in noisy environments, crucial for industrial and automotive applications.
  • Compact Size: Facilitates easy integration into space-constrained designs, enhancing design flexibility.
  • Temperature Range: Operates effectively across a wide temperature range, ensuring reliable performance in varying conditions.

MAX3373EEBL+T Technical Specifications

ParameterValue
Supply Voltage Range2.7V to 5.5V
Operating Temperature Range-40??C to +125??C
Input Voltage Range0V to Vcc
Output Current??25mA
Propagation Delay15ns
Capacitance10pF
Package Type8-Pin TDFN
Reliability RatingAutomotive Grade

MAX3373EEBL+T Advantages vs Typical Alternatives

This device outperforms typical alternatives through its low power consumption and high signal integrity, making it ideal for critical applications. Its compact design and wide operating temperature range further enhance its reliability and adaptability compared to competing products in the market.

Typical Applications

  • Industrial Automation: Ideal for signal conditioning in automation systems, ensuring reliable performance in harsh environments.
  • Automotive Electronics: Used in various automotive applications for enhanced signal integrity.
  • Portable Devices: Perfect for battery-powered devices, balancing performance and energy efficiency.
  • Consumer Electronics: Supports communication systems where reliable signal transmission is essential.

MAX3373EEBL+T Brand Info

The MAX3373EEBL+T is manufactured by a leading brand renowned for its commitment to quality and innovation in the semiconductor industry. This product exemplifies the brand’s dedication to providing high-performance electronic components that meet stringent industry standards.

FAQ

What is the maximum supply voltage for the MAX3373EEBL+T?

The maximum supply voltage for this device is 5.5V, ensuring compatibility with a wide range of applications. This feature enables it to function effectively in various electronic designs requiring reliable performance.

Can the MAX3373EEBL+T be used in automotive applications?

Yes, the device is automotive grade, making it suitable for use in automotive applications. Its reliability and performance under varying temperatures cater to the demands of the automotive sector.

What is the significance of its low power consumption?

Low power consumption is crucial as it extends battery life in portable devices and reduces energy costs in larger systems. This efficiency contributes to the overall sustainability of electronic designs.

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产品中间询盘

Is the MAX3373EEBL+T suitable for high-temperature environments?

Yes, the device operates effectively across a temperature range of -40??C to +125??C, making it suitable for high-temperature environments typically found in industrial applications.

What type of packaging does the MAX3373EEBL+T come in?

This component is available in an 8-pin TDFN package, which offers a compact footprint ideal for integration into space-constrained applications without compromising performance.

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