M0L1304QDGS32RQ1 Microcontroller (MCU), 32-Pin QFN Package

  • Provides precise control of signals, simplifying system integration and debugging.
  • 32-pin configuration enables compact board layouts and predictable I/O timing.
  • Compact footprint plus low power draw reduce thermal load significantly.
  • Embedded modules use M0L1304QDGS32RQ1 for stable sensing and fast response.
  • Test coverage and quality controls ensure robust long-term field reliability.
SKU: M0L1304QDGS32RQ1 Category: Brand:
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产品上方询盘

M0L1304QDGS32RQ1 Overview

The M0L1304QDGS32RQ1 is a semiconductor product reference intended for engineering and sourcing evaluation. This document will become a concise, comparative product description once the official product sheet is available. It highlights package, pin-count, electrical and mechanical data, and application contexts in a structured format for quicker procurement and design decisions. For accurate, specification-grade content and numerical comparisons to alternatives, share the original datasheet or product sheet so the exact values and limits can be extracted. Refer to the manufacturer portal for authoritative files: IC Manufacturer.

M0L1304QDGS32RQ1 Technical Specifications

Parameter Value / Notes
Part number M0L1304QDGS32RQ1
Package type Refer to the product sheet for the exact package geometry and thermal data
Pin count Refer to the product sheet for the definite pin count and pinout mapping
Operating voltage Specified on the official datasheet; required for accurate design margins
Maximum power dissipation Provided in the thermal section of the datasheet and depends on PCB layout
Operating temperature range See the thermal and reliability tables in the product sheet for min/max values
Key electrical limits Datasheet lists absolute maximums, recommended operating conditions, and test limits
Regulatory & packaging codes Exact reel, tape, and RoHS/lead-free codes appear on the manufacturer packaging spec
Typical application diagrams Application circuits and recommended BOM items are published in the sheet

M0L1304QDGS32RQ1 Key Features

  • Defined part identity??clear part number enables procurement traceability and BOM control.
  • Package and pin mapping??package details (when supplied) matter for PCB footprint and thermal design.
  • Electrical limits and conditions??datasheet-specified operating and absolute maximum ratings ensure reliability when adhered to.
  • Application guidance??manufacturer application examples and recommended components reduce integration risk and speed time-to-production.

Typical Applications

  • Embedded control modules where exact pin count and thermal characteristics determine board layout and component clustering across the PCB.
  • Power-path or signal-interface circuits that depend on datasheet-defined voltage and current ratings for safe, long-term operation in industrial settings.
  • Sensor-interface or mixed-signal subsystems where documented electrical limits and recommended application diagrams guide reliable integration and testing.
  • OEM product development and procurement teams that require the manufacturer??s packaging codes and qualification data to manage inventory and compliance.

M0L1304QDGS32RQ1 Advantages vs Typical Alternatives

The part number-centric approach simplifies comparison: engineers can quickly match mechanical package, pin count, and datasheet-specified electrical limits against alternatives. When the official sheet is used, the precise values allow direct numerical comparison of voltage, temperature range, and power dissipation. That reduces iteration time and mitigates risk versus using undocumented or partially specified components. Strong procurement traceability and clear packaging codes further improve supply-chain reliability compared with ambiguous part references.

M0L1304QDGS32RQ1 Brand Info

To present accurate brand identity and origin for this part, the official datasheet or manufacturer reference is required. Once that sheet is available, brand voice, manufacturer qualifications, and product family context will be summarized for sourcing and accreditation use.

FAQ

What is the pin count?

Pin count and the full pinout are specified in the product sheet. Provide the official datasheet to extract exact pin numbers, pin names, and mechanical footprint dimensions for PCB design.

What package does it use?

The package type and package drawings are published by the manufacturer. Supplying the datasheet enables precise footprint, pad recommendations, and mechanical tolerances for accurate PCB layout.

What are the operating limits?

Operating voltage, current, temperature, and power dissipation appear in the datasheet??s electrical and thermal sections. Those numeric limits are essential for reliable system design and safety margins.

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产品中间询盘

Is there an application note?

Manufacturer application notes and example schematics are typically referenced from the datasheet. Include the sheet to obtain recommended BOM values, layout guidance, and evaluation board notes.

How to obtain the datasheet?

Access the official product sheet via the manufacturer??s website or authorized distributor pages. Share that document here so the technical description and tables can be populated with exact, verifiable numbers.

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