LM3S8971-IQC50-A2 ARM Cortex-M3 Microcontroller, QFP-50 Package

LM3S8971-IQC50-A2 Overview

The LM3S8971-IQC50-A2 product sheet is required to produce a fully accurate, specification-driven product description. I do not have the referenced sheet content here, so I cannot assert electrical ratings, memory sizes, pin counts, or verified peripheral lists. Once the sheet is available I will extract verified CPU architecture, clock rates, package type, power limits, memory and peripheral counts, and thermal/ordering information into a concise engineer-focused summary. For sourcing and authorized distribution data consult IC Manufacturer for validated vendor and ordering references.

LM3S8971-IQC50-A2 Technical Specifications

LM3S8971-IQC50-A2 Key Features

• Verified core and clock ?? I will extract the exact processor core and maximum operating frequency to determine processing throughput and real-time suitability.
• Memory configuration ?? Exact flash and SRAM quantities matter for firmware size, bootloader space, and runtime stack allocations.
• Peripheral integration ?? Confirmed on-sheet peripheral counts reduce external component needs and speed system integration.
• Package and thermal specs ?? Verified package type and temperature ratings inform board layout, PCB thermal planning, and sourcing constraints.

Typical Applications

• Industrial control nodes where verified microcontroller specifications determine deterministic timing, IO count, and rugged operating temperature limits for factory automation.
• Embedded networking appliances that require validated communication interfaces and memory sizes for protocol stacks, route tables, and firmware updates.
• Motor control and actuator drivers that depend on confirmed CPU performance, PWM resources, and analog peripheral availability for precise control loops.
• Instrumentation and measurement modules where known ADC resolution, sampling rates, and environmental ratings are necessary for accurate data acquisition and long-term reliability.

LM3S8971-IQC50-A2 Advantages vs Typical Alternatives

Without the sheet I cannot claim specific numerical advantages. However, a specification-led comparison highlights where the LM3S8971-IQC50-A2 will typically show value: compare verified core frequency and memory sizes against alternatives to judge raw compute and code capacity; compare documented peripheral counts to determine integration level and board-level BOM reduction; and compare package and thermal ratings to evaluate deployment in industrial temperature classes.

LM3S8971-IQC50-A2 Brand Info

I cannot reliably identify the exact brand attribution from the context available here without the product sheet. Provide the sheet and I will extract the official manufacturer name, family branding, legacy history, and relevant brand-level support channels so sourcing specialists can validate supply chain and warranty details.

FAQ

Can you create a full spec sheet?

Yes. Once the actual product sheet is uploaded or pasted here, I will extract verified values for core type, clock rate, memory, peripherals, package, and electrical limits into a complete, engineer-ready description.

What file formats are accepted?

Supply the datasheet as a PDF, scanned image, or plain text. Pasted tabular content or a link to the manufacturer??s PDF are acceptable so I can parse exact specifications and part-marking details.

Will you include ordering codes?

After reviewing the datasheet I will list full ordering codes, package suffixes, and temperature or revision variants exactly as specified for procurement and BOM entries.

Can you compare this part to others?

I can produce a targeted comparison once I have this sheet. I will align key numeric metrics ?? CPU speed, flash/SRAM size, I/O counts, and electrical limits ?? against chosen alternatives for clear decision-making.

How fast can you deliver the description?

Delivery time depends on the datasheet length and complexity. For a standard microcontroller datasheet I usually produce a full, verified product description within one business day after receiving the document.