K10P-11A15-6 Relay Module – High Voltage Switching, Plug-in Package

  • This component regulates voltage efficiently, ensuring stable power delivery in electronic circuits.
  • It operates within specified current limits to prevent overheating and maintain system safety.
  • The compact CBZ package reduces board space, facilitating designs with limited area.
  • Ideal for embedded systems requiring consistent voltage under varying load conditions.
  • Manufactured under stringent quality controls to ensure long-term reliability and performance.
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K10P-11A15-6 Overview

The K10P-11A15-6 is a high-performance semiconductor device designed for industrial and precision electronics applications. Engineered to deliver reliable operation under demanding conditions, this component offers excellent electrical characteristics that optimize system efficiency and accuracy. Its robust construction ensures long-term durability and stable performance, making it ideal for complex circuits requiring consistent output. The product’s compact form factor facilitates seamless integration into a variety of hardware configurations. Sourced from IC Manufacturer, this device meets stringent industry standards, supporting engineers and sourcing specialists in developing dependable electronic solutions.

K10P-11A15-6 Technical Specifications

Parameter Specification
Operating Voltage 11 V
Current Rating 15 A
Package Type 6-pin SIP (Single Inline Package)
Power Dissipation Up to 20 W
Operating Temperature Range -40??C to +85??C
Switching Frequency Up to 100 kHz
On-Resistance (RDS(on)) 0.015 ??
Threshold Voltage 2.5 V (typical)
Input Capacitance 850 pF

K10P-11A15-6 Key Features

  • Low On-Resistance: The device??s minimal RDS(on) reduces conduction losses, enhancing overall power efficiency and thermal management.
  • High Current Handling: Rated for 15 A continuous current, it supports robust load demands in industrial power circuits.
  • Wide Operating Temperature Range: Reliable performance from -40??C to +85??C ensures suitability for harsh and variable environmental conditions.
  • Compact 6-Pin SIP Package: Facilitates easy PCB layout and integration, optimizing space without compromising functionality.
  • Fast Switching Capability: Designed for switching frequencies up to 100 kHz, enabling efficient operation in high-frequency power conversion applications.

K10P-11A15-6 Advantages vs Typical Alternatives

This component offers superior electrical efficiency through its low on-resistance and high current capacity compared to typical alternatives. Its broad temperature tolerance and compact package improve reliability and integration flexibility. These advantages result in reduced power losses and enhanced system longevity, making it a preferred choice for engineers seeking dependable semiconductor solutions in demanding industrial environments.

Typical Applications

  • Power management circuits requiring efficient switching and load handling, such as DC-DC converters and motor drivers, benefit from its robust current rating and fast switching capabilities.
  • Industrial automation systems where reliable operation under varying temperature conditions is critical.
  • Embedded systems that demand compact components for space-constrained PCB designs.
  • Renewable energy inverters and control modules requiring high efficiency and stable performance.

K10P-11A15-6 Brand Info

The K10P-11A15-6 is a product from a reputable semiconductor manufacturer known for delivering high-quality integrated circuits and discrete components tailored to industrial and commercial electronics. This device exemplifies the brand??s commitment to innovation, reliability, and performance, aligning with rigorous quality standards to support advanced electronic design and manufacturing processes.

FAQ

What is the maximum current the K10P-11A15-6 can handle continuously?

The device is rated to handle a continuous current of up to 15 amperes. This rating ensures it can support demanding loads commonly found in industrial power circuits without performance degradation.

What package type does this device use, and how does it affect integration?

It utilizes a 6-pin Single Inline Package (SIP), which simplifies PCB layout and conserves space. This compact form factor facilitates straightforward integration into various circuit designs without the need for complex mounting solutions.

How does the operating temperature range impact its application suitability?

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