JANKCCF2N3498-Transistor-Die Overview
The JANKCCF2N3498-Transistor-Die is a high-performance semiconductor component designed for precision switching and amplification in industrial electronic applications. This transistor die delivers robust electrical characteristics, including strong current handling and voltage resistance, making it suitable for demanding environments. Engineered for integration into custom modules, the die form factor allows for compact, efficient circuit designs. Sourced from a reputable IC Manufacturer, this transistor die ensures consistent quality and reliability for engineers and sourcing specialists seeking dependable semiconductor solutions.
JANKCCF2N3498-Transistor-Die Key Features
- High current capability: Enables effective power management in switching applications, reducing thermal stress and enhancing device longevity.
- Robust voltage handling: Supports higher voltage thresholds, ensuring stable operation under varied electrical loads.
- Compact die form: Facilitates custom packaging and integration, optimizing space in high-density electronic assemblies.
- Consistent electrical performance: Ensures repeatability and reliability critical for precision industrial controls and signal amplification.
JANKCCF2N3498-Transistor-Die Technical Specifications
| Parameter | Value | Units |
|---|---|---|
| Collector-Emitter Voltage (Vce) | 120 | V |
| Collector Current (Ic) | 15 | A |
| Power Dissipation (Pd) | 160 | W |
| Transition Frequency (fT) | 40 | MHz |
| Gain Bandwidth Product | 40 | MHz |
| Base-Emitter Voltage (Vbe) | 2.5 | V |
| Junction Temperature (Tj) | 150 | ??C |
| Package Type | Die form | ?C |
JANKCCF2N3498-Transistor-Die Advantages vs Typical Alternatives
This transistor die offers superior current and voltage handling compared to many standard alternatives, contributing to enhanced power efficiency and thermal management. Its die form allows for flexible integration into custom packages, giving engineers design adaptability not possible with packaged transistors. Additionally, the device??s stable electrical characteristics ensure reliable operation in industrial and high-frequency applications, improving system longevity and performance.
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Typical Applications
- Power amplification in industrial control systems, where consistent high current and voltage handling are critical for operational stability and efficiency.
- High-frequency switching circuits, leveraging its transition frequency for efficient signal processing.
- Custom semiconductor modules requiring compact transistor dies for space-constrained designs.
- Automotive electronics that demand rugged, reliable transistor components capable of withstanding harsh environments.
JANKCCF2N3498-Transistor-Die Brand Info
The JANKCCF2N3498-Transistor-Die is produced by a leading manufacturer known for its stringent quality standards and innovation in semiconductor technology. This product line reflects the brand??s commitment to delivering high-reliability transistor dies tailored for industrial applications. Each die undergoes thorough testing to ensure compliance with electrical and thermal specifications, offering engineers and sourcing professionals a dependable component for advanced electronic designs.
FAQ
What is the maximum collector current rating for this transistor die?
The maximum collector current rating is 15 amperes, allowing the device to handle significant power levels in switching and amplification applications without compromising performance or reliability.
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Can this transistor die be used in high-frequency applications?
Yes, with a transition frequency of 40 MHz, it is suitable for high-frequency switching and amplification tasks, making it effective in communication and signal processing circuits.
What are the thermal limits of the JANKCCF2N3498 transistor die?
The die can safely operate up to a junction temperature of 150??C, which supports use in environments requiring robust thermal management and heat dissipation strategies.
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Is this transistor provided in a packaged form or only as a die?
This specific product is supplied as a bare transistor die, intended for integration into custom packages or modules by the end user or OEM, allowing for tailored circuit design.
How does the die form factor benefit engineers in design integration?
The die form allows engineers to incorporate the transistor into compact, high-density circuit assemblies, offering flexibility in packaging and enabling optimized thermal and electrical performance within custom solutions.
