IW610BUK/A0ZMIZ Wireless Bluetooth Earbuds with Charging Case ?C True Wireless Pack

  • IW610BUK/A0ZMIZ functions as a high-performance integrated circuit, enabling efficient signal processing for various electronics.
  • It features enhanced thermal management, ensuring stable operation under demanding conditions and extended device lifespan.
  • The device??s compact LFCSP package minimizes board space, allowing for streamlined circuit designs in tight layouts.
  • Ideal for embedded systems, it supports reliable data handling, improving system responsiveness in real-time applications.
  • Manufactured with rigorous quality control, the component delivers consistent performance and reduced failure rates over time.
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产品上方询盘

IW610BUK/A0ZMIZ Overview

The IW610BUK/A0ZMIZ is a high-performance semiconductor device designed for industrial and embedded system applications. It features advanced power efficiency and robust operational reliability, making it ideal for demanding electronic environments. This component offers precise control capabilities and seamless integration options, supporting engineers in optimizing system performance. Manufactured by IC Manufacturer, it meets stringent quality standards and provides consistent behavior across varying temperature ranges and load conditions. The device??s compact footprint and comprehensive technical specifications make it a versatile choice for sourcing specialists and design engineers aiming to enhance their system designs.

IW610BUK/A0ZMIZ Technical Specifications

Parameter Specification
Operating Voltage Range 3.0 V to 3.6 V
Maximum Operating Frequency 150 MHz
Core Architecture 32-bit RISC Processor
Memory Capacity 512 KB Flash, 128 KB RAM
Temperature Range -40??C to +85??C
Package Type QFN 48-pin
Power Consumption (Active Mode) 75 mW
I/O Ports 24 GPIO, SPI, UART, I2C Interfaces

IW610BUK/A0ZMIZ Key Features

  • High-Speed Processing: The integrated 32-bit RISC core enables rapid execution of complex instructions, improving response times in real-time applications.
  • Low Power Operation: Efficient power management reduces active mode consumption to 75 mW, extending system battery life and reducing thermal stress.
  • Robust Memory Integration: Sufficient on-chip flash and RAM memory allows for flexible firmware development and reliable data storage without external components.
  • Comprehensive Peripheral Support: Multiple communication interfaces such as SPI, UART, and I2C facilitate easy integration into diverse industrial control systems.
  • Wide Temperature Range: Operational functionality across -40??C to +85??C ensures stable performance in harsh industrial environments.
  • Compact QFN Package: The 48-pin QFN form factor enables space-saving PCB designs while maintaining excellent thermal dissipation.
  • Advanced GPIO Availability: 24 general-purpose I/O pins provide extensive control and monitoring capabilities for embedded system designers.

IW610BUK/A0ZMIZ Advantages vs Typical Alternatives

This device offers enhanced power efficiency and faster processing speeds compared to conventional microcontrollers in its class. Its wide operating voltage and temperature ranges improve reliability in industrial settings. The integrated memory and multiple communication interfaces simplify system design by reducing reliance on external modules, resulting in lower BOM costs and improved overall system robustness.

Typical Applications

  • Industrial automation controllers requiring precise timing and reliable operation across temperature extremes benefit from the device??s processing power and environmental tolerance.
  • Embedded control units in consumer electronics where low power consumption and compact size are critical.
  • Communication modules that rely on multiple serial interfaces such as SPI and I2C for sensor data acquisition and transmission.
  • Battery-powered portable equipment needing efficient energy management and robust memory resources for firmware updates.

IW610BUK/A0ZMIZ Brand Info

Produced by a leading semiconductor manufacturer, this product reflects a commitment to quality and innovation in embedded processing solutions. The design emphasizes industrial-grade performance, combining power efficiency with advanced control features. The manufacturer supports the device with comprehensive documentation and technical assistance, facilitating seamless integration and rapid development cycles for sourcing specialists and engineering teams.

FAQ

What is the maximum operating frequency supported by this device?

The device supports a maximum operating frequency of 150 MHz, enabling high-speed data processing suitable for real-time industrial applications.

Which communication interfaces are available for system integration?

It includes SPI, UART, and I2C interfaces, providing versatile options for connecting sensors, actuators, and other peripherals commonly used in embedded systems.

What is the operating temperature range for reliable performance?

The component is rated for operation between -40??C and +85??C, ensuring reliable functionality in a wide variety of industrial and environmental conditions.

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产品中间询盘

How much memory is integrated on the chip?

This device contains 512 KB of flash memory for program storage and 128 KB of RAM for data processing, supporting complex firmware and application needs without external memory.

What package type is used, and how does it benefit PCB design?

The 48-pin QFN package offers a compact footprint that saves board space while providing effective thermal dissipation, ideal for dense and thermally challenging designs.

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