IRFR4105TRPBF Overview
The IRFR4105TRPBF is a robust N-channel HEXFET power MOSFET, engineered for high-performance switching and amplification tasks across a broad range of industrial and commercial electronics. Featuring a compact D2PAK/TO-263-3 surface-mount package, this device supports efficient thermal management and ease of PCB integration. Key electrical characteristics include a drain-to-source voltage rating of 55V and a continuous drain current capability of 74A, making it suitable for power conversion, motor control, and high-efficiency switching supplies. For engineers and sourcing professionals, the IRFR4105TRPBF delivers reliable MOSFET technology from the experts at IC Manufacturer.
IRFR4105TRPBF Technical Specifications
| Parameter | Value |
|---|---|
| Transistor Type | N-Channel MOSFET |
| Drain-Source Voltage (VDS) | 55V |
| Continuous Drain Current (ID) | 74A |
| RDS(on) (Max) | 8.7 m?? |
| Gate-Source Voltage (VGS) | ?I20V |
| Package Type | TO-263 (D2PAK), Surface Mount |
| Mounting Style | SMD/SMT |
| Polarity | N-Channel |
IRFR4105TRPBF Key Features
- High current handling up to 74A enables robust power management in demanding applications.
- Low RDS(on) of 8.7 m?? reduces conduction losses, improving overall energy efficiency for switching circuits.
- 55V drain-source voltage rating ensures suitability for medium-voltage power conversion and industrial control systems.
- Surface-mount D2PAK/TO-263-3 package enhances heat dissipation and simplifies automated assembly.
IRFR4105TRPBF Advantages vs Typical Alternatives
Compared to typical power MOSFETs, this device delivers significantly lower RDS(on) and higher current capability, which translates to reduced power losses and enhanced reliability in high-load environments. Its surface-mount package streamlines PCB assembly and supports superior thermal performance, making it a strong choice for modern, compact power designs and industrial automation systems.
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Typical Applications
- Power supply switching: The high current and voltage ratings make it ideal for primary and secondary side switching in AC-DC and DC-DC converters, enabling efficient energy transfer in industrial power supplies.
- Motor control: Used in H-bridge and half-bridge configurations for precise DC motor speed and torque regulation in automation equipment.
- Load switching: Supports high-current load switching in battery management systems and uninterruptible power supplies (UPS), ensuring reliable power delivery.
- Inverter circuits: Suitable for inverters and synchronous rectification in renewable energy systems, such as solar inverters and power conditioning equipment.
IRFR4105TRPBF Brand Info
The IRFR4105TRPBF is a product designed and manufactured by a leading supplier in the semiconductor industry, recognized for advanced MOSFET technology and stringent quality control. This device exemplifies the brand??s commitment to delivering reliable, high-performance power transistors for demanding industrial and commercial environments. Its engineering focuses on efficiency, thermal stability, and ease of integration, making it a preferred choice for OEMs and design engineers worldwide.
FAQ
What is the maximum drain-source voltage that this MOSFET can handle?
The specified drain-source voltage is 55V, allowing it to be safely used in medium-voltage power circuits and switching applications without risk of breakdown under normal operating conditions.
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What are the benefits of using the TO-263 (D2PAK) package for this component?
The TO-263 (D2PAK) package offers excellent thermal conductivity and is well-suited for surface mount assembly, enabling efficient heat dissipation and compact PCB layouts in high-power applications.
Can this MOSFET be used in high-current applications?
Yes, with a continuous drain current rating of 74A, this device is particularly suitable for high-current roles, such as motor control, load switching, and power supply regulation in industrial systems.
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How does the low RDS(on) value benefit circuit performance?
A low RDS(on) of 8.7 m?? minimizes conduction losses during operation, resulting in improved energy efficiency, reduced heat generation, and higher overall system reliability in switching circuits.
Is this MOSFET compatible with automated surface-mount technology (SMT) production lines?
Yes, the device is designed for surface-mount installation using the D2PAK/TO-263-3 package, making it compatible with standard SMT assembly processes for streamlined, high-volume manufacturing.
