IRF6674TRPBF Overview
The IRF6674TRPBF is a high-efficiency N-channel MOSFET optimized for low-voltage, high-speed switching applications in industrial and commercial electronics. Engineered with a compact PowerPAK? SO-8 package, this device excels in minimizing conduction losses and reducing board space requirements, making it an ideal choice for designers seeking performance and efficiency. Its low RDS(on) and robust current handling enable reliable operation in demanding environments, such as power management and DC-DC conversion. For procurement and detailed component data, visit IC Manufacturer.
IRF6674TRPBF Technical Specifications
| Parameter | Details |
|---|---|
| Type | N-Channel MOSFET |
| Package / Case | PowerPAK? SO-8 |
| Mounting Style | Surface Mount (SMD/SMT) |
| Drain-Source Voltage (VDS) | 30V |
| Continuous Drain Current (ID) | Single: 31A (at 25??C) |
| RDS(on) (Max) | 4.6 m?? @ 10V VGS |
| Gate Charge (Qg) | 13 nC (typical) |
| Operating Temperature Range | -55??C to +150??C |
| Lead Free / RoHS Status | Lead Free, RoHS Compliant |
IRF6674TRPBF Key Features
- Ultra-low RDS(on) of 4.6 m?? provides minimal conduction losses, improving overall power efficiency in switching circuits.
- High current handling capability (up to 31A) enables use in demanding load applications, supporting robust performance in power management systems.
- Compact PowerPAK? SO-8 package allows for higher power density and space savings on densely populated PCBs.
- Low gate charge (Qg 13 nC) supports fast switching and reduced gate drive requirements, optimizing system response and lowering losses.
- Wide operating temperature range ensures reliable function in harsh or temperature-varying environments.
- RoHS compliant and lead-free construction supports sustainable, regulation-compliant manufacturing processes.
IRF6674TRPBF Advantages vs Typical Alternatives
Compared to standard MOSFET options, this device stands out for its superior low RDS(on) and high current capability, which combine to reduce conduction losses and enhance system efficiency. Its PowerPAK? SO-8 packaging further supports higher power density and improved thermal performance, making it more reliable and easier to integrate into compact designs than many conventional alternatives.
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Typical Applications
- DC-DC Power Conversion: Suitable for use in synchronous buck converters, the IRF6674TRPBF improves efficiency in server, telecom, and industrial power supplies by minimizing switching and conduction losses.
- Load Switching: Ideal for high-current load switching in battery management systems, thanks to its strong current handling and low on-resistance.
- Motor Drive Circuits: Can be employed in compact motor drivers where efficiency and board space are critical design considerations.
- General High-Speed Switching: Supports a wide range of industrial and commercial electronics requiring rapid switching with minimal energy loss.
IRF6674TRPBF Brand Info
This device is part of a leading family of low-voltage, high-current MOSFETs designed for demanding industrial and commercial applications. The PowerPAK? SO-8 package reflects a commitment to both electrical performance and mechanical robustness, offering reliable operation and easy integration into modern, space-constrained designs. Its compliance with environmental standards further underscores the brand’s focus on sustainable and responsible manufacturing.
FAQ
What makes the IRF6674TRPBF ideal for low-voltage power management applications?
The combination of low on-resistance and high current handling allows it to efficiently switch and manage power in low-voltage circuits. This reduces energy loss and heat generation, ensuring effective performance in power management tasks.
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Can this MOSFET be used in high-frequency switching applications?
Yes, the low gate charge and efficient switching characteristics enable its use in high-frequency applications, such as synchronous buck converters and high-speed load switches, where fast response and reduced losses are crucial.
Is the PowerPAK? SO-8 package suitable for automated assembly?
The surface-mount design and industry-standard SO-8 footprint make the package compatible with automated pick-and-place assembly lines, supporting efficient and reliable mass production processes.
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How does RoHS compliance benefit manufacturers using this device?
RoHS compliance ensures that the MOSFET meets environmental regulations by avoiding hazardous substances. This supports manufacturers in meeting global environmental standards and entering regulated markets without redesign.
What precautions should be taken when designing with this MOSFET?
It is important to consider thermal management and proper PCB layout to maximize performance and reliability. Adequate heat sinking and attention to switching conditions will help ensure optimal operation in demanding applications.
