IPQ-5332-1-MRQFN251-TR-03-0 Networking SoC MRQFN251 package

IPQ-5332-1-MRQFN251-TR-03-0 Overview

The IPQ-5332-1-MRQFN251-TR-03-0 is a high-pin-count, board-mount part designed for automated production and dense system integration. The part number identifies a 251-pin MRQFN package shipped on tape-and-reel for pick-and-place assembly, revision 03-0. This configuration targets applications that require more I/O and tighter mechanical profile than smaller QFN options. Sourcing teams and design engineers can reference mechanical and procurement details quickly via the IC datasheet and the IC Manufacturer portal for ordering and library data.

IPQ-5332-1-MRQFN251-TR-03-0 Technical Specifications

IPQ-5332-1-MRQFN251-TR-03-0 Key Features

• High pin density: 251 pins deliver significantly more I/O than typical 64- or 128-pin QFN parts, enabling richer peripheral connectivity.
• Low-profile MRQFN package: compact footprint with an exposed thermal pad supports lower z-height and improved board stacking compared to larger BGA options.
• Tape-and-reel packaging: optimized for automated assembly to reduce handling time and accelerate pick-and-place throughput for high-volume production.
• Revision traceability: 03-0 revision code on the part number supports clear revision control and procurement tracking across BOMs.

Typical Applications

• High-density networking equipment: suitable for compact routers and gateways that require many external interfaces and a low-profile package for rack or wall-mounted designs.
• Carrier and enterprise access points: ideal for densely populated PCBs where a high pin count and thermal pad improve integration and long-term reliability during continuous operation.
• Embedded communication modules: fits module-level designs that need a 251-pad footprint to break out multiple RF, logic, and power domains in a single component.
• Industrial control appliances: supports systems where automated assembly, clear revision labeling, and a robust SMD package reduce manufacturing cost and improve yield.

IPQ-5332-1-MRQFN251-TR-03-0 Advantages vs Typical Alternatives

The MRQFN251 variant provides a balance of pin density and mechanical simplicity that many BGAs cannot match without complex board design. Compared with smaller QFNs, the 251-pin count enables more direct I/O and reduces the need for external multiplexers. The tape-and-reel format speeds SMT line throughput versus cut-tape handling. Revision coding in the part string simplifies procurement and lifecycle tracking for engineers and sourcing teams.

IPQ-5332-1-MRQFN251-TR-03-0 Brand Info

The IPQ-5332-1 family is part of the IPQ series from Qualcomm??s networking product lines. The brand focuses on silicon for networking and communications, emphasizing high integration and scalable platforms for enterprise and carrier equipment. Engineers recognize the IPQ name for board-level solutions where pin count and production readiness matter.

FAQ

What does MRQFN251 mean?

MRQFN251 indicates a molded, rectangular QFN-style package with 251 external pads. The notation highlights a high pad count QFN variant optimized for surface-mount assembly and an exposed thermal pad on the package base.

Is the part supplied for pick-and-place?

Yes. The TR in the part number denotes tape-and-reel shipment, which is compatible with standard SMT pick-and-place feeders and automated assembly processes for high-volume manufacturing.

How should I prepare the PCB footprint?

Create a PCB footprint that matches 251 pads plus the central exposed thermal pad. Follow the mechanical drawing and recommended land pattern for pad sizes, solder mask, and thermal vias to ensure reliable solder joints and heat dissipation.

How does the revision code affect procurement?

The revision segment 03-0 in the ordering code identifies the specific release or lot. Use the exact full part number when ordering to ensure consistent revision control and to avoid cross-revision substitutions in production runs.

Where can I find mechanical and ordering data?

Refer to the official datasheet and the manufacturer??s ordering guides for complete mechanical drawings, tape-and-reel packing details, and recommended land pattern files. These documents provide the exact dimensions and handling notes required for reliable assembly.