IPQ-5332-1-MRQFN251-MT-03-0 Wi-Fi Networking SoC MRQFN251 Package

IPQ-5332-1-MRQFN251-MT-03-0 Overview

The IPQ-5332-1-MRQFN251-MT-03-0 is a network-class semiconductor package option specified for the IPQ-5332 family. It identifies a 251-pin MRQFN package with a variant marker -1 and a revision code 03-0. This part code also carries a packaging suffix -MT for automated assembly handling. The data sheet lists the package configuration and ordering code clearly for procurement and assembly teams. For sourcing and datasheet access visit IC Manufacturer.

IPQ-5332-1-MRQFN251-MT-03-0 Technical Specifications

IPQ-5332-1-MRQFN251-MT-03-0 Key Features

• High pin count in a compact footprint: 251 pins enable dense I/O mapping for network SoC integration.
• MRQFN package style: supports low-profile surface-mount assembly for modern PCB stacks.
• Clear variant and revision codes: simplifies revision control and BOM management for production runs.
• Automated packaging suffix: -MT facilitates tape-and-reel logistics and high-volume pick-and-place.

Typical Applications

• High-performance networking equipment where a compact, multi-pin MRQFN package is required for SoC routing and thermal planning across dense PCBs with multiple Ethernet interfaces.
• Carrier and edge routers that need a high pin-count device to route multiple high-speed interfaces and power rails on a single board layer set reliably.
• Enterprise Wi?Fi access points or gateways that demand a low-profile package for slim mechanical designs while keeping many external I/O connections available for RF and wired subsystems.
• Telecom and industrial network appliances where clear ordering codes and revision control reduce deployment risk and ease long-term sourcing for multi-year production cycles.

IPQ-5332-1-MRQFN251-MT-03-0 Advantages vs Typical Alternatives

The MRQFN251 option provides a higher pin count in a smaller profile compared with larger BGA alternatives, which can reduce board area and simplify mechanical design. The explicit variant and revision codes improve traceability versus generic package listings. Tape-and-reel readiness with the -MT suffix lowers pick-and-place integration time and supports faster assembly rates. These traits make the part more practical for volume manufacturing and tighter board-space constraints.

IPQ-5332-1-MRQFN251-MT-03-0 Brand Info

The IPQ-5332 family is associated with Qualcomm??s IPQ platform lineage. The brand voice emphasizes networking performance, integration flexibility, and supply-chain clarity. Customers expect clear part coding, revision control, and packaging options that align with high-volume manufacturing and long product lifecycles.

FAQ

What does MRQFN251 indicate?

MRQFN251 denotes a molded, rectangular quad-flat no-leads package with 251 pins. It defines the package style and pin count that determine footprint, solder pad layout, and thermal pad design for PCB integration.

What does the -MT suffix mean?

The -MT suffix identifies the part as supplied in a packaging format suitable for automated assembly. It indicates tape-and-reel handling for surface-mount pick-and-place processes and volume production setups.

How is revision 03-0 used?

The revision code 03-0 is a manufacturer-designated identifier for the specific release or mask set. Use it to match BOM records and ensure correct PCB footprints and assembly documentation for that revision.

Is this package suitable for reflow assembly?

Yes. MRQFN packages are designed for standard surface-mount reflow processes. Follow the manufacturer??s reflow profile and solder paste recommendations to control solder joint quality and thermal stress.

How should engineers handle footprint design?

Designers should reference the official mechanical drawing for pad size, thermal pad, and keep-out dimensions. Use the exact package identifier MRQFN251 and revision code when retrieving footprint files to avoid mismatches during PCB layout.