IPQ-5322-0-MRQFN251-TR-03-0 Wi-Fi Networking SoC in MRQFN251 Package

IPQ-5322-0-MRQFN251-TR-03-0 Overview

The IPQ-5322-0-MRQFN251-TR-03-0 is a high-pin-count, surface-mount component presented in a 251-pin MRQFN package. The part is supplied on tape-and-reel for automated assembly and carries a production revision code of 03-0. The package density and lead count make it suitable where more I/O and tighter board integration are required compared with 64- or 128-pin alternatives. For procurement and additional documentation, visit IC Manufacturer.

IPQ-5322-0-MRQFN251-TR-03-0 Technical Specifications

IPQ-5322-0-MRQFN251-TR-03-0 Key Features

• High pin count (251 pins) enables greater I/O density and supports more peripherals than 64- or 128-pin packages.
• MRQFN form-factor delivers a low-profile surface-mount solution, which matters for compact or stacked PCB designs where height and thermal path are constrained.
• Tape-and-reel packaging supports automated pick-and-place and reflow processes, reducing assembly time and cost compared to bulk or tray packaging.
• Clear revision code (03-0) and series identifier simplify BOM control and version tracking for sourcing and qualification workflows.

Typical Applications

• High-density communications modules where 251 pins provide the I/O flexibility to route multiple high-speed interfaces and analog signals in a compact footprint.
• Board-level designs that require surface-mount placement for automated assembly and consistent soldering quality at production volumes above hundreds per reel.
• Industrial control units that need a low-profile MRQFN package to maintain rugged enclosure clearances while offering expanded I/O compared with lower-pin alternatives.
• Embedded gateway and access-point platforms where higher pin counts reduce the need for external multiplexers and enable more direct connections to discrete peripherals.

IPQ-5322-0-MRQFN251-TR-03-0 Advantages vs Typical Alternatives

Compared with smaller QFN variants, the 251-pin MRQFN package provides significantly more signal I/O and routing freedom. The tape-and-reel format streamlines surface-mount manufacturing and reduces per-unit handling time compared with trays. The explicit revision code supports tighter configuration control versus ambiguous suffixes. For designers balancing board space, I/O capacity, and assembly throughput, this configuration offers a clear trade-off: higher integration and fewer external components at similar or lower assembly cost than multi-board alternatives.

IPQ-5322-0-MRQFN251-TR-03-0 Brand Info

The IPQ-5322-0-MRQFN251-TR-03-0 belongs to the IPQ family associated with Qualcomm networking SoCs and related silicon. The brand voice emphasizes integration, production-ready packaging, and supply-chain clarity for networking and embedded electronics customers.

FAQ

What does MRQFN251 indicate?

MRQFN251 denotes a multi-row quad flat-no-leads package with 251 contacts. It implies a low-profile surface-mount module designed for dense I/O and compact PCB layouts.

Is the part delivered for automated assembly?

Yes. The TR code in the part number specifies tape-and-reel packaging, which is compatible with automated pick-and-place and standard reflow assembly processes.

How does the 251-pin count help design?

A 251-pin package increases available I/O and power/ground pins. This reduces the need for external bus expanders and allows more direct connections to peripherals on a single PCB.

What does the revision code 03-0 mean?

The 03-0 suffix is a production or revision identifier. It helps purchasing and engineering teams match board revisions, firmware, and documentation to the correct hardware revision.

Can this package save board space?

Yes. The QFN family is low-profile and soldered directly to the PCB. Compared to discrete or socketed alternatives, it typically reduces height and can improve thermal transfer to the board.