IPQ-5321-0-MRQFN251-TR-03-0 Wi-Fi Networking SoC MRQFN251

IPQ-5321-0-MRQFN251-TR-03-0 Overview

The IPQ-5321-0-MRQFN251-TR-03-0 is a high-pin-count surface-mount device offered in a 251-pin MRQFN package and supplied in tape-and-reel format for automated assembly. The part number encodes the series, package family and revision, which simplifies procurement and BOM traceability for production runs. Its 251-pin footprint supports dense I/O mapping and complex board routing while MRQFN form factor preserves a relatively low profile. For sourcing and technical documentation, see the part reference at IC Manufacturer.

IPQ-5321-0-MRQFN251-TR-03-0 Technical Specifications

IPQ-5321-0-MRQFN251-TR-03-0 Key Features

• High pin density: 251 pins provide extensive I/O count for complex system integration and multiple peripheral interfaces.
• MRQFN package: low-profile, lead-frame quad-flat no-leads style that helps save board height while enabling high routing density.
• Tape-and-reel supply: TR packaging supports automated pick-and-place and high-volume SMT assembly for consistent yields.
• Traceable revisioning: the 03-0 revision code simplifies revision control and pick accuracy for production and procurement workflows.

Typical Applications

• High-density system controllers where dozens to hundreds of I/Os are required on a compact printed circuit board for industrial automation equipment.
• Network infrastructure modules that require many interfaces and compact packaging to fit inside multiport routers, switches, or gateway modules.
• Embedded communication systems in enterprise access points that demand a high pin count for RF, baseband, and peripheral routing on a compact board.
• Custom SoC carrier boards and development platforms where board designers need a predictable tape-and-reel part for repeatable assembly and testing cycles.

IPQ-5321-0-MRQFN251-TR-03-0 Advantages vs Typical Alternatives

Compared with lower-pin or larger-ball-grid alternatives, this MRQFN 251-pin option delivers a higher pin count in a lower-profile package, enabling greater I/O density with less board thickness. The tape-and-reel shipment format reduces manual handling and improves placement speed versus tray-pack options. The explicit revision and variant codes in the part number improve BOM clarity and reduce sourcing errors relative to ambiguous or single-field part identifiers.

IPQ-5321-0-MRQFN251-TR-03-0 Brand Info

The IPQ family is associated with Qualcomm Technologies’ networking SoC lineage, historically marketed under Qualcomm Atheros. This nomenclature indicates a focus on integrated networking and communications platforms. Engineers sourcing this part should align the part number with Qualcomm-branded documentation and distributor listings for compatibility and support.

FAQ

What package does this part use?

The part uses an MRQFN package indicated by the string MRQFN251. That denotes a QFN-style package with 251 pins and a low-profile surface-mount format for compact board designs.

How many pins are available?

This device provides 251 pins as encoded in the part name. The high pin count supports multiple power, ground and I/O connections for dense system integration.

What does TR mean?

The TR suffix stands for tape and reel packaging. It indicates the device is supplied on reels suitable for automated pick-and-place lines and high-volume SMT assembly.

How is the revision identified?

The revision is shown as 03-0 in the part number. Use this code to match PCB silk, assembly documentation and firmware revisions to the correct hardware build.

Where should I source datasheets?

Refer to the manufacturer’s official product documentation and authorized distributor pages for the exact datasheet and mechanical drawings. Match the full part string to ensure package, pinout and revision details align with your BOM.